Robert M Mcandrew

US Patent:

20120111379, May 10, 2012

Filed:

Nov 4, 2010

Appl. No.:

12/939896

Inventors:

Ronda K. Nixon - San Francisco CA, US
Iqbal A. Shareef - Fremont CA, US
Mark I. Wagner - Austin TX, US
Robert McAndrew - Austin TX, US
Tony Ray Kroeker - Georgetown TX, US

International Classification:

B08B 3/00

US Classification:

134198

Abstract:

A processing chamber for post-wet-etch removing of drying fluid (DF) is disclosed. The chamber includes a chamber wall surrounding a processing volume and a plurality of nozzles disposed annularly about the processing volume and arranged into a set of nozzle rows that includes at least one nozzle row. The chamber also includes a plenum and a set of manifolds coupled to the plurality of nozzles to deliver the supercritical COto the plurality of nozzles. Each nozzle has a nozzle outlet directed toward an interior portion of the processing volume and the nozzles are configured to flow the supercritical COtoward the substrates in a manner that minimizes recirculation loops and vortices.