Hughes & Luce LLP 1717 Main Street Suite 2800, Dallas, TX 75201 5124826836 (Office), 5124826859 (Fax)
Licenses:
Texas - Eligible To Practice In Texas 2001
Education:
University of Texas School of Law Degree - JD - Juris Doctor - Law Graduated - 2000 University of Texas System, Austin Degree - BA - Bachelor of Arts Graduated - 1997
UBS O'CONNOR LLC New York, NY Mar 2008 to Jun 2013 Director, Capital Goods (Industrials) Analyst/Portfolio ManagerBANC OF AMERICA SECURITIES LLC New York, NY May 2006 to Feb 2008 Senior Analyst, Vice President, Electrical Equipment/Multi-Industry Group, Equity ResearchElectrical Equipment New York, NY 2006 to 2008Equity Research
Mar 2004 to May 2006 Senior Analyst, Director, Industrial Multi-Industry GroupMORGAN STANLEY New York, NY Aug 2001 to Mar 2004 Senior Research Associate, Electrical Equipment/ Multi-Industry Group, Equity ResearchING BARING FURMAN SELZ LLC New York, NY Jul 1997 to Jul 1999 Associate, Investment Banking Division - Health Care Group
Education:
THE WHARTON SCHOOL OF BUSINESS, The University of Pennsylvania Philadelphia, PA May 2001 Master of Business AdministrationDARTMOUTH COLLEGE Hanover, NH 1998Wharton Durham, NC May 1997 Juris Doctor in FinanceDartmouth Rugby May 1994 A.B. in English
Dr. McCarthy graduated from the Rush Medical College in 1991. He works in Columbia, MD and specializes in Cardiovascular Disease. Dr. McCarthy is affiliated with Howard County General Hospital.
Robert Patrick Mccarthy MD 710 Sunset Dr STE F, La Grande, OR 97850 5419636985 (phone), 5419755135 (fax)
Education:
Medical School University of Kansas School of Medicine Graduated: 1982
Procedures:
Cystoscopy Cystourethroscopy Kidney Stone Lithotripsy Transurethral Resection of Prostate Vaginal Repair Prostate Biopsy Urinary Flow Tests Vasectomy
Conditions:
Benign Prostatic Hypertrophy Bladder Cancer Calculus of the Urinary System Erectile Dysfunction (ED) Kidney Cancer
Languages:
English
Description:
Dr. McCarthy graduated from the University of Kansas School of Medicine in 1982. He works in La Grande, OR and specializes in Urology. Dr. McCarthy is affiliated with Grande Ronde Hospital.
Rajen M. Murugan - Garland TX, US Robert F. McCarthy - Dallas TX, US Baher S. Haroun - Allen TX, US Peter R. Harper - Lucas TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 23/48
US Classification:
257737, 257E23021, 257E21536, 438393, 438613
Abstract:
One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts.
Robert Fabian McCarthy - Dallas TX, US Stanley Craig Beddingfield - McKinney TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 23/495
US Classification:
257669, 257673, 257727, 257780, 257786, 257E23169
Abstract:
An integrated circuit (IC) device includes a substrate having a top surface including active circuitry including a plurality of I/O nodes, and a plurality of die pads coupled to the plurality of I/O nodes. A first dielectric layer including first dielectric vias is over the plurality of die pads. A redirect layer (RDL) including a plurality of RDL capture pads is coupled to the plurality of die pads over the first dielectric vias. A second dielectric layer including second dielectric vias is over the plurality of RDL capture pads. At least one of the second dielectric vias is a crack arrest via that has a via shape that includes an apex that faces away from a neutral stress point of the IC die and is oriented along a line from the neutral stress point to the crack arrest via to face in a range of 30 degrees from the line. Under bump metallization (UBM) pads are coupled to the plurality of RDL capture pads over the second dielectric vias, and metal bonding connectors are on the UBM pads.
System And Method For Improving Reliability Of Integrated Circuit Packages
Stanley Craig Beddingfield - McKinney TX, US Orlando Florendo Torres - Richardson TX, US Robert Fabian McCarthy - Dallas TX, US
International Classification:
H01L 23/495 H01L 21/58
US Classification:
257666, 438123, 257E21499, 257E23039
Abstract:
An integrated circuit package includes a die, a bump, an underbump metallization layer formed between the bump and the die, a portion of the underbump metallization layer under the bump having a first radius, and a redistribution layer formed between the underbump metallization layer and the die. The redistribution layer has a pad positioned under the underbump metallization layer. The pad has a second radius, and makes contact with the underbump metallization layer. The second radius is less than or equal to the first radius. The integrated circuit package also includes a first dielectric layer disposed between the die and the redistributing layer.
Robert Fabian McCarthy - Dallas TX, US Stanley Craig Beddingfield - McKinney TX, US
International Classification:
H01L 23/52 G06F 9/455
US Classification:
257778, 716 11, 257E23141
Abstract:
An integrated circuit device includes a functional circuit die with a patterned rewiring layer defining a first rewiring pad and one or more second rewiring pads on opposite sides of a neutral point of the die. The device also includes at least one dielectric layer having bump opening features over the rewiring pads. The device further includes electrically conductive bump pad features formed on the dielectric layer over the bump opening features. The bump pad features make contact with the rewiring pads via the bump opening features. In the device, a center of the bump opening features are laterally offset from a center of the bump pad feature towards a neutral point of the die.
Method And Apparatus For Providing Virtual Messaging
MICHAEL MCCARTHY - LITTLE SILVER NJ, US ROBERT MCCARTHY - MARLBOROUGH MA, US DAVID ITTNER - MANALAPAN NJ, US SAUL ENBINDER - HOLMDEL NJ, US HOWARD FRISCH - WESTFIELD NJ, US
Assignee:
UREACH TECHNOLOGIES, INC. - Holmdel NJ
International Classification:
H04M 1/64
US Classification:
379 8808
Abstract:
A method and apparatus of providing virtual messaging is provided. The method comprises examining status information associated with a plurality of servers for notifying call recipients of messages using at least one messaging protocol, wherein each of the plurality of servers operates independently, identifying an available server of the plurality of servers, based on the status information, for handling a message and directing an incoming call to the available server, wherein the available server stores the message until communication of the message to at least one call recipient, wherein the available server communicates at least one notification message associated with the message to at least one telephone number of the at least one call recipient, wherein the at least one notification message comprises a telephone number associated with the call origination device and a message link number for communicating with the available server.
System And Method For Improving Reliability Of Integrated Circuit Packages
Stanley Craig BEDDINGFIELD - McKinney TX, US Orlando Florendo TORRES - Richardson TX, US Robert Fabian McCARTHY - Dallas TX, US
Assignee:
TEXAS INSTRUMENTS INCORPORATED - Dallas TX
International Classification:
H01L 23/48
US Classification:
257737, 257E23141
Abstract:
An integrated circuit package includes a die, a bump, an underbump metallization layer formed between the bump and the die, a portion of the underbump metallization layer under the bump having a first radius, and a redistribution layer formed between the underbump metallization layer and the die. The redistribution layer has a pad positioned under the underbump metallization layer. The pad has a second radius, and makes contact with the underbump metallization layer. The second radius is less than or equal to the first radius. The integrated circuit package also includes a first dielectric layer disposed between the die and the redistributing layer.
Method And Apparatus For Providing Called Party Data To A Subscriber Of A Call Forwarding System Via At Least One Mobile Network
Saul Einbinder - Holmdel NJ, US David Ittner - Manalapan NJ, US Robert McCarthy - Marlborough MA, US
Assignee:
UREACH TECHNOLOGIES, INC. - Holmdel NJ
International Classification:
H04W 4/16
US Classification:
455417
Abstract:
A method and apparatus for providing called party data to a subscriber of a call forwarding system via at least one mobile network. In one embodiment, the method includes processing an incoming call to a subscriber device of a call forwarding system, identifying a calling number and a called number of the incoming call, wherein the called number corresponds with a call forwarding number of the subscriber device, accessing called party data that is associated with the called number, and communicating the called party data to the subscriber device.
A method of making a wafer level chip size package (WCSP) comprising providing a die having a first face with a plurality of bond pads thereon, a second face opposite the first face and a plurality of side faces extending between the first face and the second face, at least one of the plurality of side faces having saw induced microcracks therein; and coating at least one of the plurality of side faces with a thin veneer of adhesive that penetrates the microcracks. A WCSP produced by the method is also disclosed.
Almost a year into the payments industry, and more than ten years prior in the mobile industry: Solutions Architect, Sales Engineer, Director of Field Applications Engineering, Program Director for 3G...
Tagline:
Product Manager for Merchant Warehouse
Bragging Rights:
Helped SavaJe win JavaOne product of the year (?) back in the day with a phone I designed with a CM in Hong Kong
Robert Mccarthy
Work:
Saluki Athletics - Marketing Graphic Designer
Education:
SIUC - Communication Design
About:
Jedis, bass, dragons, vroom.
Tagline:
Boxerbriefs, the best of both worlds.
Bragging Rights:
Piloted an X-Wing in the battle of the Death Star.
The Telstra Legends of League Final saw the Illawarra team, Albion Park PS (Rod Wishart Shield winners) take victory over the South Sydney side, Mascot PS (Bob McCarthy Shield Winners) 22 - 6. The best performing country team was won by the Hunter ...
Principal Robert McCarthy expects that his faculty and staff will be fully prepared to address any questions that the visiting team of educators might have. "Our accreditation is dependent upon a satisfactory review of what they see," McCarthy said. ...
Authority directors promise to resolve discolored water issues
David Garrett / Staff Photographer Robert McCarthy of Fallsington shows the effect of the orange water on his shower heads. Robert McCarthy Yardley Ave. Fallsington said his water is orange at least once a day. Today he received this flyer from a ...
Robert McCarthy and his neighbors just want some resolution to the orange-tinted water that often comes from the pipes in their homes in historic Fallsington. They plan to band together tonight to bring their concerns to the board of directors of ...
Town Human Resources Director Robert P. McCarthy said that if Rick Anderson were a regular town employee, he would have difficulty meeting residency standards. If he was an employee, it would be pretty cut and dried, he said. ...