Robert A Mclean

US Patent:

6720203, Apr 13, 2004

Filed:

Feb 26, 2003

Appl. No.:

10/374611

Inventors:

Peter Francis Carcia - Wilmington DE
Robert Scott McLean - Hockessin DE

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01L 5140

US Classification:

438 99, 257 40, 313511

Abstract:

Flexible composite barrier structures are used to improve the resistance, to oxygen and moisture degradation, of an organic electronic device including at least one active layer comprising an organic material.

US Patent:

7005798, Feb 28, 2006

Filed:

May 28, 2004

Appl. No.:

10/856512

Inventors:

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01J 1/62
H01L 21/56
H01L 31/12

US Classification:

313498, 313505, 313506, 313511, 313512, 428690, 428917, 428331, 438116, 438118, 438127, 257E31095

Abstract:

The present invention relates to a device having a flexible organic electronic device comprising in the order listed:.

US Patent:

7067843, Jun 27, 2006

Filed:

Sep 24, 2003

Appl. No.:

10/669940

Inventors:

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01L 29/04

US Classification:

257 59

Abstract:

Transistors fabricated with transparent oxide semiconductors are provided. The semiconductors are metal oxides deposited without the intentional incorporation of additional doping elements, and enable the fabrication of transparent thin film transistors. The transparent transistors can be used to control pixels in a display, without significantly reducing the active area of the pixels.

US Patent:

7470607, Dec 30, 2008

Filed:

Oct 10, 2003

Appl. No.:

10/527173

Inventors:

Peter Francis Carcia - Wilmington DE, US
Robert S. McLean - Hockessin DE, US

Assignee:

E.I. Du Pont De Nemours & Company - Wilmington DE

International Classification:

H01L 21/44

US Classification:

438609, 438608, 257E33064, 257E31126

Abstract:

This invention relates to novel, transparent oxide semiconductor thin film transistors (TFT's) and a process for making them.

US Patent:

8445937, May 21, 2013

Filed:

Mar 26, 2008

Appl. No.:

12/055560

Inventors:

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

Assignee:

E I du Pont de Nemours and Company - Wilmington DE

International Classification:

H01L 33/00

US Classification:

257100, 257E33059

Abstract:

Gas permeation barriers can be deposited on plastic or glass substrates by atomic layer deposition (ALD). The use of the ALD coatings can reduce permeation by many orders of magnitude at thicknesses of tens of nanometers with low concentrations of coating defects. These thin coatings preserve the flexibility and transparency of the plastic substrate. Such articles are useful in container, electrical and electronic applications.

US Patent:

8524003, Sep 3, 2013

Filed:

Aug 31, 2009

Appl. No.:

12/550766

Inventors:

Peter Francis Carcia - Wilmington DE, US
Calixto Estrada - Middletown DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Kirstin H. Shilkitus - Landenberg PA, US

Assignee:

E I du Pont de Nemours and Company - Wilmington DE

International Classification:

C23C 16/00

US Classification:

118718, 118500

Abstract:

A cassette for supporting a film during a gaseous vapor deposition has first and second end plates. A rib on each end plate forms a spiral groove that edgewise receives a spiral wrapping of a film having a width greater than 300 mm. Spaces between turns of the film wrapping define a gas flow channel and spaces between adjacent turns of the rib define a plurality of inlet openings in one end plate that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0. 5% to about 2.

US Patent:

8529700, Sep 10, 2013

Filed:

Aug 31, 2009

Appl. No.:

12/550832

Inventors:

Peter Francis Carcia - Wilmington DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Geoffrey Nunes - Swarthmore PA, US
Kirstin H. Shilkitus - Landenberg PA, US

Assignee:

E I Du Pont de Nemours and Company - Wilmington DE

International Classification:

C23C 16/00

US Classification:

118718, 118500

Abstract:

A vapor deposition apparatus includes an insert within which a material is deposited on the surface of a film. A cassette includes end plates each having a rib that edgewise receive a spiral wrapping of a film at least 300 mm wide. Spaces between turns of the wrapping define a gas flow channel and spaces between adjacent turns of one rib define inlet openings that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least 300 mm and is also greater than the film width at deposition temperature. The width dimension of each rib is between about 0. 5% to about 2. 0% of the end plate spacing.

US Patent:

8551249, Oct 8, 2013

Filed:

Aug 31, 2009

Appl. No.:

12/550743

Inventors:

Peter Francis Carcia - Wilmington DE, US
Calixto Estrada - Middletown DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Kirstin H. Shilkitus - Landenberg PA, US

Assignee:

E I du Pont de Nemours and Company - Wilmington DE

International Classification:

C23C 16/00

US Classification:

118718, 118500

Abstract:

A cassette for supporting a film during a gaseous vapor deposition process includes a central shaft having first and second end plates. A rib on each end plate forms a spiral groove able to accept an edge of a film. Each rib has a cross sectional configuration having substantially linear major edges, a predetermined width dimension and a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The rib could be substantially rectangular with an optional flow spoiler at the free end or substantially wedge-shaped. The interspoke spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0. 5% to about 2.