Robert Alison Owen

US Patent:

40077403, Feb 15, 1977

Filed:

Feb 11, 1976

Appl. No.:

5/657000

Inventors:

Robert A. Owen - Mount Prospect IL

Assignee:

Illinois Tool Works Inc. - Chicago IL

International Classification:

A61M 500

US Classification:

128221

Abstract:

A tamper-proof, hermetically sealed cover for a cannula having a sharpened distal end. The cover is initially tubular encircling and covering a substantial portion of the cannula length and extending outwardly beyond the distal end. The free end of the cover is flattened and formed to provide a bubble-like chamber spaced in all directions from the sharpened distal end to avoid damage to the sharpened end; to hermetically seal the end for aseptic conditions and to prevent tampering if the cannula connects to a medicament source.

US Patent:

56049773, Feb 25, 1997

Filed:

Jun 7, 1995

Appl. No.:

8/478570

Inventors:

James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01R 4300

US Classification:

29825

Abstract:

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

US Patent:

54573181, Oct 10, 1995

Filed:

Apr 29, 1994

Appl. No.:

8/235413

Inventors:

James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01J 506

US Classification:

250332

Abstract:

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

US Patent:

50476440, Sep 10, 1991

Filed:

Jul 31, 1989

Appl. No.:

7/387918

Inventors:

Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Mary E. Cronin - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01J 506

US Classification:

250332

Abstract:

A mesa (31) is formed from polyimide (or a similar polymer material) to achieve a high thermal resistance. In an exemplary thermal imaging application, an array of thermal isolation mesa structures (30) are disposed on an integrated circuit substrate (20) for electrically connecting and bonding a corresponding focal plane array (5) of thermal sensors (10). Each mesa structure (30) includes a polyimide mesa (31) over which is formed a metal conductor (32) that extends from the top of the mesa down a mesa sidewall to an adjacent IC contact pad (22). When the focal plane array (5) is bonded to the corresponding array of thermal isolation mesa structure (30), a thermally isolated, but electrically conductive path is provided between the sensor signal electrode (16) of the thermal sensor (10) and the corresponding contact pad (22) of the integrated circuit substrate (20).

US Patent:

20220275593, Sep 1, 2022

Filed:

Feb 26, 2021

Appl. No.:

17/187221

Inventors:

- Des Plaines IL, US
Robert Owen - Chicago IL, US

International Classification:

E01F 15/14

Abstract:

The present disclosure includes a modular crash attenuator system including an array of attenuator segment pair assemblies. Each attenuator segment pair assembly includes a first attenuator segment and a second attenuator segment, a tensioning assembly configured to removably couple the first attenuator segment adjacent to the second attenuator segment, and a coupling assembly configured to removably couple the attenuator segment pair assembly to at least one other attenuator segment pair assembly. The crash attenuator system additionally includes a barrier attachment assembly disposed at a first end of the array and coupled to at least one attenuator segment pair and an end cap assembly disposed at a second end of the array, the second end being opposite the first end.

US Patent:

20210304645, Sep 30, 2021

Filed:

Mar 27, 2020

Appl. No.:

16/833159

Inventors:

- Des Plaines IL, US
Robert Owen - Chicago IL, US

International Classification:

G09F 15/00

Abstract:

A sign frame is provided. In one aspect, the sign frame includes a first panel and a first coupling assembly. The first coupling assembly is integrally formed with the first panel. The sign frame includes a second panel and a second coupling assembly. The second coupling assembly is integrally formed with the second panel. The second coupling assembly is removably coupled to the first coupling assembly. The first panel operatively pivots with respect to the second panel, between a stowed position and a deployed position, about the first coupling assembly and the second coupling assembly that are removably coupled.

Address:

1445 W Glenlake Ave, Chicago, IL 60660

VIN:

JHMGD37647S035197

Make:

HONDA

Model:

FIT

Year:

2007