Robert S Pyles

US Patent:

8598602, Dec 3, 2013

Filed:

Jun 28, 2010

Appl. No.:

12/825075

Inventors:

Christopher P. Hussell - Cary NC, US
Sung Chul Joo - Raleigh NC, US
Robert S. Pyles - Holly Springs NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/64

US Classification:

257 88

Abstract:

Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.