Robert C Randall

US Patent:

39309037, Jan 6, 1976

Filed:

Feb 7, 1974

Appl. No.:

5/440523

Inventors:

Robert N. Randall - Wayland MA
James Wong - Wayland MA

Assignee:

Supercon, Inc. - Natick MA

International Classification:

H01L 3900
H01B 1200

US Classification:

148 32

Abstract:

A stable, high field, high current conductor is produced by packing multiple, multi-layer rods of a bronze core and niobium or vanadium inner jacket and copper outer jacket into a pure copper tube or other means for forming a pure copper matrix, sealing, working the packed tube to a wire, and by diffusion, heat treating to form a type II superconducting, Beta-Wolfram structure, intermetallic compound as a layer within each of several filaments derived from the rods. The layer of Beta-Wolfram structure compound may be formed in less than 2 hours of diffusion heat treatment in a thickness of 0. 5-2 microns.

US Patent:

20200077074, Mar 5, 2020

Filed:

Aug 28, 2019

Appl. No.:

16/553727

Inventors:

Scott Denenberg - Newton MA, US
Lev Persits - Cambridge MA, US
Clara Vu - Cambridge MA, US
Robert Craig Randall - Newton MA, US
Patrick Sobalvarro - Harvard MA, US
Valentina Chamorro - Somerville MA, US
Gene Malkin - Brookline MA, US
Alberto Moel - Cambridge MA, US

International Classification:

H04N 13/246
G06T 7/80
H04N 13/271
H04N 13/254
H04N 13/194

Abstract:

In various embodiments, systems and methods for calibrating a sensor array for 3D depth sensing include the steps of providing multiple 3D sensors each for (i) illuminating a field of view of the sensor and (ii) generating an output array of pixelwise values indicative of distances to objects within the illuminated a field of view; sequentially causing each of the 3D sensors to generate an output array while other 3D sensors are illuminating their fields of view; and creating an interference matrix from the generated output arrays, the interference matrix indicating, for each of the 3D sensors, a degree of interference by other 3D sensors simultaneously active therewith.

US Patent:

20200077075, Mar 5, 2020

Filed:

Aug 28, 2019

Appl. No.:

16/553729

Inventors:

Scott Denenberg - Newton MA, US
Lev Persits - Cambridge MA, US
Clara Vu - Cambridge MA, US
Robert Craig Randall - Newton MA, US
Patrick Sobalvarro - Harvard MA, US
Valentina Chamorro - Somerville MA, US
Gene Malkin - Brookline MA, US
Alberto Moel - Cambridge MA, US

International Classification:

H04N 13/246
G06T 7/80
H04N 13/271
H04N 13/254
H04N 13/194
H04N 5/357

Abstract:

In various embodiments, systems and methods for generating a digital representation of a 3D space and objects therein include the steps of providing one or more 3D sensors for generating an output array of pixelwise values, the values including an optical intensity value and a value indicative of an estimated distances to an object within a field of view of the sensor; and processing successive output arrays originating from the 3D sensor(s) into a pixelwise array of depth values, each of the depth values having an associated error metric based at least in part on the associated intensity value.

US Patent:

20200077078, Mar 5, 2020

Filed:

Aug 28, 2019

Appl. No.:

16/553724

Inventors:

Scott Denenberg - Newton MA, US
Lev Persits - Cambridge MA, US
Clara Vu - Cambridge MA, US
Robert Craig Randall - Newton MA, US
Patrick Sobalvarro - Harvard MA, US
Valentina Chamorro - Somerville MA, US
Gene Malkin - Brookline MA, US
Alberto Moel - Cambridge MA, US

International Classification:

H04N 13/271
H04N 13/204

Abstract:

In various embodiments, systems and methods for acquiring depth images utilize an architecture suited to safety-rated applications, and may include more than sensor (such as time-of-flight sensors) operating along different optical paths and a comparison module for ensuring proper sensor operation. Error metrics may be associated with pixel-level depth values for purposes of allowing safe control based on imperfectly known depths.