Robert W Simons

US Patent:

6366462, Apr 2, 2002

Filed:

Jul 18, 2000

Appl. No.:

09/618921

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361699, 165 804, 165908, 257714

Abstract:

An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.

US Patent:

6396700, May 28, 2002

Filed:

Jun 29, 2000

Appl. No.:

09/606619

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05M 720

US Classification:

361705, 165 803, 165185, 174 163, 257707, 257713, 361690, 361718, 361722

Abstract:

A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e. g. , an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.

US Patent:

6397618, Jun 4, 2002

Filed:

May 30, 2001

Appl. No.:

09/867855

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F25B 2300

US Classification:

622592, 16510422

Abstract:

A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

US Patent:

6424533, Jul 23, 2002

Filed:

Jun 29, 2000

Appl. No.:

09/606984

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361719, 2989003, 62 37, 257930, 361704

Abstract:

A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e. g. , an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

US Patent:

6489551, Dec 3, 2002

Filed:

Nov 30, 2000

Appl. No.:

09/726900

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 3502

US Classification:

136230, 136242, 62 33, 257930

Abstract:

An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the modules electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

US Patent:

6490874, Dec 10, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/742619

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F25D 1706

US Classification:

62 93, 62271

Abstract:

A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

US Patent:

6519151, Feb 11, 2003

Filed:

Jun 27, 2001

Appl. No.:

09/893212

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361699, 165 804, 165908, 361702

Abstract:

Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

US Patent:

6548894, Apr 15, 2003

Filed:

Nov 30, 2000

Appl. No.:

09/726909

Inventors:

Richard C. Chu - Poughkeepsie NY
Robert E. Simons - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2334

US Classification:

257706, 136203

Abstract:

An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Address:

9942 E Bay St, Seminole, FL 33776

VIN:

WBAVA37577NE29199

Make:

BMW

Model:

3 SERIES

Year:

2007