Robert J Stratton

US Patent:

20120114860, May 10, 2012

Filed:

Jul 14, 2010

Appl. No.:

13/383598

Inventors:

Max Dehtiar - Saginaw MI, US
Jason Giardina - Freeland MI, US
Jaime Vanderhovel - Clio MI, US
Michael Hofmeister - Midland MI, US
Michael John Molnar - Freeland MI, US
Robert E. Stratton - Midland MI, US
Stephen Pawelkowski - Midland MI, US

International Classification:

B05D 1/00

US Classification:

427345, 118602

Abstract:

A method inhibits formation of deposits on a cooling surface of an electrode. The electrode is used in a manufacturing system that deposits a material on a carrier body. The cooling surface comprises copper. The system includes a reactor defining a chamber. The electrode is at least partially disposed within the chamber and supports the carrier body. A circulation system, in fluid communication with the electrode, transports a coolant composition to and from the cooling surface. The coolant composition comprises a coolant and dissolved copper from the cooling surface. A filtration system is in fluid communication with the circulation system. The method heats the electrode. The cooling surface of the electrode is contacted with the coolant composition. The material is deposited on the carrier body, and the coolant composition is filtered with the filtration system to remove at least a portion of the dissolved copper therefrom.