Robert J Testa

age ~68

from Owego, NY

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Also known as:

Robert Joseph Testa
Joseph C Testa

Phone and address:: 177 Stocks Rd, Flemingville, NY 13827
6076871974

Connected to:

Robert Testa Phones & Addresses

177 Stocks Rd, Owego, NY 13827 • 6076871974
Greenville, SC

Resumes

Gas Turbine Design Engineer At Ge Energy

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Position:

Gas Turbine Design Engineer at GE Energy

Location:

Greenville, South Carolina Area

Industry:

Oil & Energy

Work:

GE Energy since Jun 2008
Gas Turbine Design Engineer

Education:

Virginia Polytechnic Institute and State University 2004 - 2008
BS, Mechanical Engieering

Independent Biotechnology Professional

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Location:

United States

Industry:

Biotechnology

Strategist At Wells Fargo

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Location:

San Francisco, California

Industry:

Financial Services

Robert Testa

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Location:

United States

Medicine Doctors

Robert G. Testa

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Specialties:

Podiatric Medicine

Work:

West Lake Foot & Ankle
29099 Health Campus Dr STE 180, Westlake, OH 44145
4408351999 (phone), 4408351996 (fax)

Procedures:

Arthrocentesis
Hallux Valgus Repair

Conditions:

Plantar Fascitis
Hallux Valgus
Tinea Pedis

Languages:

English

Description:

Dr. Testa works in Westlake, OH and specializes in Podiatric Medicine. Dr. Testa is affiliated with St John Medical Center.

License Records

Robert A Testa

License #:

BA09312 - Expired

Category:

Cosmetology/Barbering

Issued Date:

May 19, 1969

Expiration Date:

Sep 30, 2002

Type:

Barber

Robert C Testa

License #:

RS076993A - Expired

Category:

Real Estate Commission

Type:

Real Estate Salesperson-Standard

Name / Title

Company / Classification

Phones & Addresses

Robert Testa
PRESIDENT

NATIONAL FOUNDATION FOR ADOLESCENT DRUG EDUCATIONto SKAROOS, INC

Robert G. Testa

FOOTPRO INC

Us Patents

Method Of Providing A Printed Circuit Board With An Edge Connection Portion
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US Patent:

20080301933, Dec 11, 2008
Filed:

Jun 7, 2007
Appl. No.:

11/808140
Inventors:

Thomas R. Miller - Endwell NY, US
Duane A. Stanke - Newark Valley NY, US
Robert J. Testa - Owego NY, US
Assignee:

Endicott Interconnect Technologies, Inc. - Endicott NY
International Classification:

H05K 3/36
H05K 3/20
US Classification:

29830, 29831, 29846, 29847, 29832, 29834
Abstract:

A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.