Robert A Walsh

US Patent:

20080047924, Feb 28, 2008

Filed:

Aug 22, 2006

Appl. No.:

11/466368

Inventors:

William E. Coats - Azusa CA, US
Robert V. Walsh - Altadena CA, US

International Classification:

B65D 83/00

US Classification:

215389, 220710

Abstract:

A bottle for containing liquids for a rider. The bottle includes a hollow container sized to be held in one hand of a rider having opposed top and bottom ends, and a continuous side wall extending between the top and bottom ends. The bottom end is closed, the top end has a filling means, and the side wall has an opening near the bottom end of the container. The opening has a closable spigot for drinking the liquid contained in the container without having to tip the bottle. The rider can hold the bottle in a generally upright position while pedaling the bicycle without having to remove his or her eyes from the road, thus improving riding safety.

US Patent:

20100325717, Dec 23, 2010

Filed:

Jun 18, 2009

Appl. No.:

12/487380

Inventors:

Varun Goel - Diamond Bar CA, US
Robert Walsh - Foster City CA, US

International Classification:

G06F 21/00
G06F 15/16
H04L 29/06

US Classification:

726 11, 709228, 709203, 709217, 726 1

Abstract:

A system for managing access to resources in a plurality of servers by a plurality of client computers by using an operating system independent Secure Shell (SSH) protocol running in each server and using a central policy database that centrally stores access rules which specify access to the servers for a plurality of users/accounts. Each time a target server receives a user request to establish an SSH session, it retrieves associated access rules from the central policy database to obtain the latest access rules. Based on the retrieved rules and the identity of the user and the identity of the client computer, the target server determines whether the user has permission to establish the SSH session with the target server. Using a centralized database and requiring the servers to always retrieve the latest access rules from a central database provides consistent application of the access rules across all servers and all client computers.

US Patent:

56054874, Feb 25, 1997

Filed:

May 13, 1994

Appl. No.:

8/242560

Inventors:

Harold J. Hileman - Kirkwood MO
Robert J. Walsh - Ballwin MO
Thomas A. Walsh - Templeton CA

Assignee:

MEMC Electric Materials, Inc. - St. Peters MO

International Classification:

B24B 4900

US Classification:

451 5

Abstract:

Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

US Patent:

62579541, Jul 10, 2001

Filed:

Feb 23, 2000

Appl. No.:

9/511030

Inventors:

Robert J. Walsh - Ballwin MO
Henry Erk - St. Louis MO
Dennis Buese - O'Fallon MO

Assignee:

MEMC Electronic Materials, Inc. - St. Peters MO

International Classification:

B24B 4900
B24B 5100

US Classification:

451 7

Abstract:

An apparatus and process for chemical-mechanical polishing an edge of a semiconductor wafer using a heated polishing pad and a heated liquid chemical slurry. The apparatus includes a rotatable drum having a cylindric outer surface, a heatable mat positioned around the outer surface of the drum, and a polishing pad in generally parallel arrangement with the mat. A wafer holder, a container of liquid slurry, and a slurry delivery system are also included. The process includes the steps of heating a liquid slurry to an elevated temperature and applying heat to the polishing pad from an underside of the polishing pad to elevate the temperature of the polishing pad. A peripheral edge of a semiconductor wafer is engaged against a polishing side of the polishing pad, and a relative motion is effected between the wafer and the pad while simultaneously dispensing the heated slurry onto a region where the edge of the wafer engages the pad.

US Patent:

39792390, Sep 7, 1976

Filed:

Dec 30, 1974

Appl. No.:

5/537478

Inventors:

Robert J. Walsh - Ballwin MO

Assignee:

Monsanto Company - St. Louis MO

International Classification:

H01L 21304

US Classification:

156 4

Abstract:

Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.

US Patent:

43167578, Feb 23, 1982

Filed:

Mar 3, 1980

Appl. No.:

6/126807

Inventors:

Robert J. Walsh - Ballwin MO

Assignee:

Monsanto Company - St. Louis MO

International Classification:

B32B 3122

US Classification:

156286

Abstract:

Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.

US Patent:

58402020, Nov 24, 1998

Filed:

Apr 26, 1996

Appl. No.:

8/639185

Inventors:

Robert J. Walsh - Ballwin MO

Assignee:

MEMC Electronic Materials, Inc. - St. Peters MO

International Classification:

H01L 2100

US Classification:

216 52

Abstract:

Apparatus for shaping a polishing pad includes a pad shaping tool and a fixture for holding the pad shaping tool free of fixed connection to the fixture. The pad shaping tool has a pad shaping surface which engages a polishing surface of the polishing pad to shape that surface. The pad shaping surface is sized for engaging the polishing surface across it entire width. The fixture constrains the tool from movement about the center of rotation of the polishing pad and constrains the center of the tool from substantial radial movement with respect to the pad. A method for shaping the polishing pad is also disclosed.

US Patent:

43132847, Feb 2, 1982

Filed:

Mar 27, 1980

Appl. No.:

6/134714

Inventors:

Robert J. Walsh - Ballwin MO

Assignee:

Monsanto Company - St. Louis MO

International Classification:

B24B 704

US Classification:

511314

Abstract:

Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.