Robert E Wang

US Patent:

20190181069, Jun 13, 2019

Filed:

Dec 12, 2018

Appl. No.:

16/217906

Inventors:

Konrad Rykaczewski - Tempe AZ, US
Robert Wang - Scottsdale AZ, US

International Classification:

H01L 23/373
B32B 5/16
B32B 27/14
B32B 27/28
B32B 27/18
H01L 23/00

Abstract:

A layered composite configured to form an interface between a heat exchanger and an integrated circuit includes a first polymer layer, a second polymer layer, a liquid metal in direct contact with the first polymer layer, a solid solute in direct contact with the second polymer layer, and a barrier between the liquid metal and the solid solute. The liquid metal is liquid at normal temperature and pressure. The solid solute includes microparticles, nanoparticles, or both and is solid at normal temperature and pressure. The barrier prevents contact of the liquid metal and the solid solute at normal temperature and pressure, and is configured to rupture under compression of the layered composite, thereby allowing the liquid metal and the solid solute to form a mixture between the first polymer layer and the second polymer layer.

Address:

20535 84 Cir, Bristol, WI 53104

VIN:

1FTPW14V78FC00391

Make:

FORD

Model:

F-150

Year:

2008