Robin Carol Johnson

US Patent:

20170125149, May 4, 2017

Filed:

Jan 17, 2017

Appl. No.:

15/408063

Inventors:

- San Jose CA, US
George Edward Curtis - San Jose CA, US
Ki Yuen Chau - Palo Alto CA, US
Sandeep Arvindkumar Patel - Los Gatos CA, US
Keith Frank Tharp - San Jose CA, US
Robin Carol Johnson - Boulder Creek CA, US
Yu Liu - Pleasanton CA, US
Billie Alton Hudson - Sadler TX, US

International Classification:

H01F 27/06
H01R 13/66
H01F 27/29
H01R 12/51
H01F 27/34
H01F 17/06
H01R 13/6461
H01R 13/719

Abstract:

The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

US Patent:

20150179328, Jun 25, 2015

Filed:

Dec 24, 2013

Appl. No.:

14/140421

Inventors:

- San Jose CA, US
George Edward Curtis - San Jose CA, US
Ki Yuen Chau - Palo Alto CA, US
Sandeep Arvindkumar Patel - Los Gatos CA, US
Keith Frank Tharp - San Jose CA, US
Robin Carol Johnson - Boulder Creek CA, US
Yu Liu - Pleasanton CA, US
Billie Alton Hudson - Sadler TX, US

International Classification:

H01F 27/04
H01F 27/29
H01F 27/06

Abstract:

The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.