Roland W Gooch

US Patent:

6392232, May 21, 2002

Filed:

Jul 19, 1996

Appl. No.:

08/690274

Inventors:

Roland W. Gooch - Dallas TX
Mark V. Wadsworth - Richardson TX

Assignee:

Pharmarcopeia, Inc. - Cranbury NJ

International Classification:

G01J 510

US Classification:

250332, 2503384

Abstract:

An array of bolometers suspended over a substrate by support arms located beneath the corresponding bolometer to allow maximum fill factor in the array.

US Patent:

6479320, Nov 12, 2002

Filed:

Feb 2, 2000

Appl. No.:

09/496826

Inventors:

Roland W. Gooch - Dallas TX

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01L 2144

US Classification:

438109, 438106, 438107

Abstract:

A method for vacuum packaging MEMS devices is provided that comprises forming a plurality of MEMS devices ( ) on a device wafer ( ). A first sealing ring ( ) is formed surrounding one of the MEMS devices ( ) and any associated mating pads ( ). A plurality of integrated circuit devices ( ) is formed on a lid wafer ( ) where each integrated circuit device ( ) has one or more associated mating pads ( ) and one or more associated bonding pads ( ). A plurality of second sealing rings ( ) is formed on the lid wafer ( ) where each of the second sealing rings ( ) surrounds one of the integrated circuit devices ( ) and any associated bonding pads ( ). The second sealing ring ( ) is positioned between the perimeter of the integrated circuit device ( ) and the associated bonding pads ( ). A sealing layer is formed on either each first sealing ring ( ) or each second sealing ring ( ). The device wafer ( ) is mated with the lid wafer ( ) in a vacuum environment to form a plurality of vacuum packages where each vacuum package encloses one or more of the MEMS devices ( ) and one or more of the integrated circuit devices ( ).

US Patent:

6521477, Feb 18, 2003

Filed:

Feb 2, 2000

Appl. No.:

09/496820

Inventors:

Roland W. Gooch - Dallas TX
Thomas R. Schimert - Ovilla TX

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01L 2144

US Classification:

438106, 438 50, 438 51, 438113, 438401, 438909

Abstract:

A method for vacuum packaging MEMS or similar devices during device fabrication comprises forming a plurality of MEMS devices ( ), or similar devices, on a device wafer ( ). A device sealing ring ( ) is formed between the MEMS devices ( ) and bonding pads ( ) connected to a MEMS device. A solder adhesion layer ( ) forms part of the device sealing ring ( ) surrounding each MEMS or similar device ( ). A lid wafer ( ) is formed having a plurality of lid sealing rings ( ) corresponding in number and location to the device sealing rings ( ). Each lid sealing ring ( ) surrounds a cavity ( ). The device wafer ( ) is aligned with the lid wafer ( ) to align each device sealing ring ( ) with the corresponding lid sealing ring ( ), leaving a gap between the lid wafer ( ) and the device wafer ( ). The resulting assembly ( ) is placed in a vacuum furnace. The vacuum furnace is evacuated and heated to a temperature sufficient to allow outgassing of all surface areas of the lid wafer ( ) and the device ( ).

US Patent:

6586831, Jul 1, 2003

Filed:

Aug 10, 2001

Appl. No.:

09/928031

Inventors:

Roland W. Gooch - Dallas TX
Thomas R. Schimert - Ovilla TX

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01L 2312

US Classification:

257704, 257666, 257667, 257668, 257723, 257787, 257788, 257789, 228124, 228217, 228221, 438106, 438107, 438109

Abstract:

A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.

US Patent:

6690014, Feb 10, 2004

Filed:

Apr 25, 2000

Appl. No.:

09/557748

Inventors:

Roland W. Gooch - Dallas TX
Thomas R. Schimert - Ovilla TX
William L. McCardel - Plano TX
Bobbi A. Ritchey - Allen TX

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01L 310376

US Classification:

2503384, 438 72, 438 96

Abstract:

A microbolometer is provided that includes an absorber element having material properties to change temperature in response to absorbing infrared radiation. An amorphous silicon detector is thermally coupled to the absorber element and is suspended above a silicon substrate at a height of one-quarter wavelength of the infrared radiation to be detected. The amorphous silicon detector changes electrical resistance in response to the absorber element changing temperature. The microbolometer also includes electrode arms coupled to the silicon substrate to provide structural support for the amorphous silicon detector above the surface of the silicon substrate. The electrode arms further provide electrical connectivity for the microbolometer.

US Patent:

6879035, Apr 12, 2005

Filed:

May 2, 2003

Appl. No.:

10/428627

Inventors:

Athanasios J. Syllaios - Richardson TX, US
Roland W. Gooch - Dallas TX, US
Thomas R. Schimert - Ovilla TX, US

International Classification:

H01L023/12

US Classification:

257704, 257684, 257678, 438106, 438456

Abstract:

A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

US Patent:

6897469, May 24, 2005

Filed:

May 2, 2003

Appl. No.:

10/428745

Inventors:

Athanasios J. Syllaios - Richardson TX, US
Roland W. Gooch - Dallas TX, US
Thomas R. Schimert - Ovilla TX, US
Edward G. Meissner - Richardson, Dallas County TX, US

International Classification:

H01L029/06
H01L023/12

US Classification:

257 10, 257680, 257704

Abstract:

A method for manufacturing optically-transparent lids includes etching sub-wavelength structures on a surface of a lid wafer. The structures may be arrayed in a hexagonally closed-packed pattern.

US Patent:

7015074, Mar 21, 2006

Filed:

Oct 18, 2004

Appl. No.:

10/967764

Inventors:

Athanasios J. Syllaios - Richardson TX, US
Roland W. Gooch - Dallas TX, US
Thomas R. Schimert - Ovilla TX, US

Assignee:

L-3 Communications Corporation - New York NY

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

438125, 438109, 438456

Abstract:

A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.