Rollie Dutton
from Beavercreek, OH
Rollie Dutton Phones & Addresses
- 544 Rustic Trl, Dayton, OH 45434 • 9374273645
- 3580 Woodgreen Dr, Dayton, OH 45434 • 9374273645
- Beavercreek, OH
Work
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Company:Universal technology company, llcJan 2019
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Position:Director of materials and manufacturing
Education
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School / High School:Missouri University of Science and Technology1987 to 1992
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Specialities:Engineering
Skills
Materials and Process Engineering • Technology Development Leader • Team Builder • Manufacturing Readiness Assessments • Integrated Computational Materials Engin...
Ranks
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Certificate:Registered Professional Engineer
Industries
Military
Resumes
Director Of Materials And Manufacturing
view sourceLocation:
Dayton, OH
Industry:
Military
Work:
Universal Technology Company, Llc
Director of Materials and Manufacturing
Universal Technology Company, Llc
Associate Director of Materials and Manufacturing
Materials and Manufacturing Directorate Air Force Research Laboratory
Senior Manufacturing Technology Advisor, Manufacturing and Industrial Technologies Division
Materials and Manufacturing Directorate Air Force Research Laboratory Oct 2012 - Jun 2017
Division Chief, Manufacturing and Industrial Technologies Division
Materials and Manufacturing Directorate Sep 2011 - Oct 2012
Acting Branch Technical Advisor, Processing and Fabrication Branch, Manufacturing Technology Division
Director of Materials and Manufacturing
Universal Technology Company, Llc
Associate Director of Materials and Manufacturing
Materials and Manufacturing Directorate Air Force Research Laboratory
Senior Manufacturing Technology Advisor, Manufacturing and Industrial Technologies Division
Materials and Manufacturing Directorate Air Force Research Laboratory Oct 2012 - Jun 2017
Division Chief, Manufacturing and Industrial Technologies Division
Materials and Manufacturing Directorate Sep 2011 - Oct 2012
Acting Branch Technical Advisor, Processing and Fabrication Branch, Manufacturing Technology Division
Education:
Missouri University of Science and Technology 1987 - 1992
Missouri University of Science and Technology 1972 - 1976
Bachelors, Bachelor of Science, Engineering
Missouri University of Science and Technology 1972 - 1976
Bachelors, Bachelor of Science, Engineering
Skills:
Materials and Process Engineering
Technology Development Leader
Team Builder
Manufacturing Readiness Assessments
Integrated Computational Materials Engineering
Technology Development Leader
Team Builder
Manufacturing Readiness Assessments
Integrated Computational Materials Engineering
Certifications:
Registered Professional Engineer
Us Patents
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High Temperature Piezoelectric Sensor
view source -
US Patent:6617764, Sep 9, 2003
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Filed:Sep 12, 2001
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Appl. No.:09/951260
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Inventors:James R. Sebastian - Kettering OH
David A. Stubbs - Waynesville OH
Rollie E. Dutton - Beavercreek OH -
Assignee:University of Dayton - Dayton OH
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International Classification:H01L 4108
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US Classification:310329, 310319
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Abstract:The present invention provides a sensor that can be operated at high temperatures. The sensor comprises a first electrode, a second electrode, and an aluminum nitride film which lies between the first and second electrode. The sensor can be used to measure pressure, acceleration, or force at high temperatures.
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Ultrasonic Transducer And Ultrasonic Detection And High Temperature Processing Systems Incorporating Same
view source -
US Patent:58864563, Mar 23, 1999
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Filed:Aug 28, 1997
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Appl. No.:8/919769
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Inventors:David A. Stubbs - Waynesville OH
Rollie E. Dutton - Beavercreek OH -
Assignee:The University of Dayton - Dayton OH
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International Classification:H01L 4108
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US Classification:310336
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Abstract:An ultrasonic transducer is provided comprising a transducer housing, a piezoelectric assembly, and a seating assembly. The transducer housing includes a front end, a rear end opposite the front end, and an ultrasonic window positioned at the front end. The piezoelectric assembly is positioned within the transducer housing and comprises a piezoelectric assembly substrate and a piezoelectric laminate formed over a front surface of the assembly substrate. The seating assembly is arranged to secure the piezoelectric assembly within the transducer housing such that at least a portion of the piezoelectric laminate is aligned with the ultrasonic window. The transducer housing, the assembly substrate, and the seating assembly are preferably constructed of high temperature and high pressure materials characterized by substantially equivalent coefficients of thermal expansion. The piezoelectric laminate may include a piezoelectric aluminum nitride layer and the assembly substrate may comprise a material selected from the group consisting of tungsten carbide, silicon carbide, silicon nitride, and graphite.
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