Romulo R Gutierrez

US Patent:

6573793, Jun 3, 2003

Filed:

Apr 10, 2002

Appl. No.:

10/120063

Inventors:

Romulo Gutierrez - Flemington NJ 08822

International Classification:

H03F 100

US Classification:

330151, 330149

Abstract:

The Reflect Forward Adaptive Linearizer Amplifier (RFAL Amplifier) assembly ( ) in FIG. provides a linerizing method that uses the input reflected signal of the Main Amplifier ( ) to develop an intermodulation-correcting signal. The invention incorporates a directional coupler at the input of the Main amplifier that samples and sums the input reflected signal from the Main Amplifier and the forward fundamental input signal to form a distortion-correcting signal that contains both the fundamental and the distortion products of the output. By proper delay and amplification of this correcting signal, it can then be used to drive another Main amplifier ( ) to both cancel the output distortion products and double the output power of the Main Amplifier with significant improvement of the overall linearity and efficiency of the final amplifier assembly. The technique allows the use of lower cost transistor up to the Pout at the 1-dB Gain Compression Point with significant distortion cancellation.

US Patent:

46440968, Feb 17, 1987

Filed:

Mar 18, 1985

Appl. No.:

6/713312

Inventors:

Romulo Gutierrez - Flemington NJ
Albert W. Bauer - Belle Mead NJ
Thomas L. McDonald - Harleysville PA

Assignee:

Alpha Industries, Inc. - Woburn MA

International Classification:

H05K 506

US Classification:

174 52H

Abstract:

A modified TO-8 package has a kovar header supporting an FET amplifier hermetically sealed by a cover welded along the seam between the cover edge and header edge. The header is formed with three circular openings in space quadrature about the package axis. A circular copper spacer contacts the header and is formed with channels extending radially outward from the header openings to define with the openings three lead channels. A lead having a right angle bend is seated in each channel having an upstanding pin portion above the header. The volume between the lead and the header is filled with hermetically sealing low expansion borosilicate glass. The remainder of each channel is filled or coated with nonconductive epoxy. The depending portions of the leads are flush with the bottom of the copper spacer. In another form the base and cover are rectangular in the form of a four-lead DIP package also having the channels, right-angle-bent leads flush with the bottom surrounded by hermetically sealing insulating low expansion borosilicate glass.