Ronald J Barnes

US Patent:

6362968, Mar 26, 2002

Filed:

Jun 28, 1999

Appl. No.:

09/340961

Inventors:

Robert J. Lajara - San Jose CA
Hassan Siahpolo - Campbell CA
Ronald Barnes - Livermore CA
Kenneth Kitlas - San Jose CA

Assignee:

Sun Microsystems, Inc. - Palo Alto CA

International Classification:

H05K 714

US Classification:

361752, 361753, 361756, 361759, 361801, 361808, 211 4117, 3122651

Abstract:

A stiffener for a printed circuit board where the stiffener is placed between the printed circuit board and a wall of the metal chassis in a computer system housing. The loaded printed circuit board may first be mounted on the stiffener, which, in turn, may then be mounted on the appropriate wall of the chassis along with the circuit board. Alternately, the stiffener may first be mounted on the appropriate chassis wall, and the circuit board may then be mounted on the stiffener. Additional circuit components may then be added onto the circuit board. The lies between the circuit board and the wall of the chassis on which the circuit board is being mounted. The back plane support provided by the stiffener may reduce damage to the conducting paths of the printed circuit board due to pressures exerted during component mounting, manufacture, transportation, etc. Additionally, a circuit board carrying densely populated electronic components may be easily mounted on or removed from the chassis without damage. Adequate board-to-chassis grounding may also be accomplished through the sheet metal stiffener frame.

US Patent:

6373697, Apr 16, 2002

Filed:

Jun 28, 1999

Appl. No.:

09/340960

Inventors:

Robert J. Lajara - San Jose CA
Milton C. Lee - Mountain Vu CA
Alan Lee Minick - San Jose CA
Kenneth A. Lown - Sunnyvale CA
Wayman Lee - Los Altos CA
Barry Marshall - San Jose CA
Anita Patel - Palo Alto CA
Steve J. Furuta - Santa Clara CA
Kenneth Kitlas - San Jose CA
Ronald Barnes - Livermore CA

Assignee:

Sun Microsystems, Inc. - Palo Alto CA

International Classification:

G06F 120

US Classification:

361687, 361697, 361700, 165122, 174 152

Abstract:

A computer system housing with a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is attached to the front of the chassis with each sideways gap extending perpendicularly from the front of the chassis to a predetermined width and stretching to predetermined length along the front of the chassis. The sideways gaps facilitate increased air inlet from the sides and allow efficient cooling of various system components that are mounted on the chassis and housed within the housing. One or more cooling fans may be mounted at different locations within the housing to optimize air circulation and, hence, cooling within the housing. The chassis may be partitioned into two separate sub-chassis for proper positioning of the cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis.

US Patent:

6542362, Apr 1, 2003

Filed:

Dec 7, 2001

Appl. No.:

10/011205

Inventors:

Robert J. Lajara - San Jose CA
Milton C. Lee - Mountain Vw CA
Alan Lee Minick - San Jose CA
Kenneth A. Lown - Sunnyvale CA
Wayman Lee - Los Altos CA
Barry Marshall - San Jose CA
Anita Patel - Palo Alto CA
Steve J. Furuta - Santa Clara CA
Kenneth Kitlas - San Jose CA
Ronald Barnes - Livermore CA

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

H05K 720

US Classification:

361687

Abstract:

A computer system housing with a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is attached to the front of the chassis with each sideways gap extending perpendicularly from the front of the chassis to a predetermined width and stretching to predetermined length along the front of the chassis. The sideways gaps facilitate increased air inlet from the sides and allow efficient cooling of various system components that are mounted on the chassis and housed within the housing. One or more cooling fans may be mounted at different locations within the housing to optimize air circulation and, hence, cooling within the housing. The chassis may be partitioned into two separate sub-chassis for proper positioning of the cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis.

US Patent:

8266413, Sep 11, 2012

Filed:

Mar 14, 2007

Appl. No.:

11/724034

Inventors:

Ronald Barnes - South Riding VA, US

Assignee:

The Board of Trustees of the University of Illinois - Urbana IL

International Classification:

G06F 9/30

US Classification:

712229, 712219

Abstract:

A processor triggers a first advanced execution processing pass to an instruction sequence in response to a first stalled instruction and initiates execution of a further instruction in the instruction sequence that stalls during the performance of the first advanced execution processing pass. A second advanced execution pass is performed through the instruction sequence in which the further instruction is processed again to provide a valid result after stalling. In one form, the first instruction is performed while the processor operates in a normal execution mode and the first and second advanced execution processing passes are performed while the processor operates in an advance execution mode.

US Patent:

59699493, Oct 19, 1999

Filed:

Mar 31, 1998

Appl. No.:

9/052817

Inventors:

David K. J. Kim - San Jose CA
Barry Marshall - San Jose CA
Ronald Barnes - Livermore CA

Assignee:

Sun Microsystems, Inc. - Mountain View CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A heat transmitting slug is attached to a chip or other heat emitting electronic component by an adhesive. A heat sink is mounted on the slug by one or more screws or other fasteners, preferably with thermal grease between the bottom of the heat sink base and the top of the slug. The top of the slug is formed with a longitudinal tongue and the base of the heat sink with a mating groove. Preferably the base of the heat sink is offset upwardly above the groove to resist tendency to fracture under stress.

US Patent:

59127996, Jun 15, 1999

Filed:

Jul 1, 1996

Appl. No.:

8/674027

Inventors:

William Grouell - San Ramon CA
Michael McCormick - San Jose CA
Ronald Barnes - Livermore CA

Assignee:

Sun Microsystems, Inc. - Mountain View CA

International Classification:

G06F 116
H05K 720

US Classification:

361685

Abstract:

An enclosure is assembled from metal-plated rigid structural foam plastic components to house in minimal space in many hard disk drives. Major components, including the power supply, plug directly to a motherboard at the rear of the enclosure, eliminating internal cables. The parts fit together in snap-in fashion in such manner that the back will not close if parts are not installed properly. For ventilation, slots are formed in the sides and a central partition which permit air from fans on one side to flow laterally across all the disk drives and then out through slots in the opposite side. A side facing door permits easy access to all drives simultaneously for service and upgrade.

US Patent:

61341126, Oct 17, 2000

Filed:

Jun 27, 1997

Appl. No.:

8/883849

Inventors:

Herbert E. LeCornu - Newark CA
Ronald Barnes - Livermore CA
Nagaraj P. Mitty - San Jose CA

Assignee:

Sun Microsystems, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

361720

Abstract:

To restrain detachment of heat sinks from printed circuit boards (PCBs) or the components mounted on such boards, a body is attached to the board and extends above the tops of the heat sinks. Above each heat sink, three sides of a rectangle are cut from the body, leaving one side uncut. The tongue thus formed is curved downwards to form a spring which bears against the top of the heat sink to protect the heat sink from disengagement. The body is formed with vertical ends or legs having outward bent feet which are secured to the PCB by screws or other fasteners or are fit through slots in the PCB. A slanted tongue may also be cut from the body to engage an upper corner of a heat sink to restrain the heat sink from lateral movement relative to the PCB.

US Patent:

59911573, Nov 23, 1999

Filed:

Mar 31, 1998

Appl. No.:

9/052872

Inventors:

David K. J. Kim - San Jose CA
Barry Marshall - San Jose CA
Ronald Barnes - Livermore CA

Assignee:

Sun Microsystems, Inc. - Mountain View CA

International Classification:

H05K 720

US Classification:

361719

Abstract:

A module consists of a shroud or enclosure attached to a card containing heat-emitting electronic components or to a stack of two or more vertically spaced cards; one or all of which have heat sinks in thermal contact with at least some of the electronic components. The shroud is apertured to control air flow in many directions over the components and heatsinks. A hinge member extends along one edge of the module shaped to be inserted in a slot in a panel to establish a hinge. As the shroud is pivoted about the hinge, horizontal electrical contacts on the panel and at least one card interengage and vertical contacts on one of the cards remote from the hinge simultaneously interengage. The contour of the shroud aids in installing or removing the module.