Ronald K Ellis

US Patent:

6357275, Mar 19, 2002

Filed:

Nov 21, 2000

Appl. No.:

09/721028

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B21D 2202

US Classification:

72414, 29827

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6390350, May 21, 2002

Filed:

May 22, 2001

Appl. No.:

09/862238

Inventors:

Rich Fogal - Boise ID
Michael B. Ball - Boise ID
Ronald W. Ellis - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3704

US Classification:

228 45, 228 495, 2281805

Abstract:

A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

US Patent:

6454153, Sep 24, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797725

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3704

US Classification:

228 45, 228 151

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6474532, Nov 5, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797790

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 106

US Classification:

2281101, 2281735

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6504257, Jan 7, 2003

Filed:

Nov 21, 2000

Appl. No.:

09/718597

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2940

US Classification:

257782, 257786, 257666

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6509205, Jan 21, 2003

Filed:

Apr 3, 2001

Appl. No.:

09/825656

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2144

US Classification:

438106, 438611

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6607121, Aug 19, 2003

Filed:

May 6, 2002

Appl. No.:

10/139430

Inventors:

Rich Fogal - Boise ID
Michael B. Ball - Boise ID
Ronald W. Ellis - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3102

US Classification:

2281805, 228 45, 228 495

Abstract:

A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

US Patent:

62217488, Apr 24, 2001

Filed:

Aug 19, 1999

Appl. No.:

9/378198

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2144

US Classification:

438611

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

Address:

3291 N Gawaine Pl, Boise, ID 83704

VIN:

2GCEK13M371649486

Make:

CHEVROLET

Model:

SILVERADO 1500

Year:

2007