Ronald James Warren

US Patent:

6580140, Jun 17, 2003

Filed:

Sep 18, 2000

Appl. No.:

09/665584

Inventors:

Arne W. Ballantine - Cold Spring NY
Jeffrey D. Gilbert - South Burlington VT
Robert G. Miller - Essex Junction VT
Amy L. Myrick - Waterbury Ctr. CT
Ronald A. Warren - Milton VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 31058

US Classification:

257467, 257 43, 257 48, 257751

Abstract:

A method, and associated structure, for monitoring temperature and temperature distributions in a heating chamber for a temperature range of 200 to 600Â C. , wherein the heating chamber may be used in the fabrication of a semiconductor device. A copper layer is deposited over a surface of a semiconductor wafer. Next, the wafer is heated in an ambient oxygen atmosphere to a temperature in the range of 200-600Â C. The heating of the wafer oxidizes a portion of the copper layer, which generates an oxide layer. After being heated, the wafer is removed and a sheet resistance is measured at points on the wafer surface. Since the local sheet resistance is a function of the local thickness of the oxide layer, a spatial distribution of sheet resistance over the wafer surface reflects a distribution of wafer temperature across the wafer surface during the heating of the wafer. The measured spatial distribution of sheet resistance may be utilized to readjust the spatial distribution of heat input to another wafer in order to achieve a more uniform temperature across the other wafers surface. In addition, the monitor may be reconditioned for repeated use by heating the monitor in a hydrogen ambient environment to convert the oxide layer to unoxidized copper.

US Patent:

6759260, Jul 6, 2004

Filed:

Apr 23, 2003

Appl. No.:

10/421986

Inventors:

Arne W. Ballantine - Cold Spring NY
Jeffrey D. Gilbert - South Burlington VT
Robert G. Miller - Essex Junction VT
Amy L. Myrick - Waterbury Ctr. VT
Ronald A. Warren - Milton VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2166

US Classification:

438 18, 438 54, 438104, 438653

Abstract:

A method, and associated structure, for monitoring temperature and temperature distributions in a heating chamber for a temperature range of 200 to 600Â C. , wherein the heating chamber may be used in the fabrication of a semiconductor device. A copper layer is deposited over a surface of a semiconductor wafer. Next, the wafer is heated in an ambient oxygen atmosphere to a temperature in the range of 200-600Â C. The heating of the wafer oxidizes a portion of the copper layer, which generates an oxide layer. After being heated, the wafer is removed and a sheet resistance is measured at points on the wafer surface. Since the local sheet resistance is a function of the local thickness of the oxide layer, a spatial distribution of sheet resistance over the wafer surface reflects a distribution of wafer temperature across the wafer surface during the heating of the wafer. The measured spatial distribution of sheet resistance may be utilized to readjust the spatial distribution of heat input to another wafer in order to achieve a more uniform temperature across the other wafers surface. In addition, the monitor may be reconditioned for repeated use by heating the monitor in a hydrogen ambient environment to convert the oxide layer to unoxidized copper.

US Patent:

55335403, Jul 9, 1996

Filed:

Jan 10, 1995

Appl. No.:

8/370714

Inventors:

David Stanasolovich - Montgomery NY
William A. Syverson - Colchester VT
Ronald A. Warren - Troy NY

Assignee:

Inernational Business Machines Corporation - Armonk NY

International Classification:

B08B 310

US Classification:

134155

Abstract:

Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

US Patent:

54276225, Jun 27, 1995

Filed:

Jul 18, 1994

Appl. No.:

8/276684

Inventors:

David Stanasolovich - Montgomery NY
William A. Syverson - Colchester VT
Ronald A. Warren - Troy NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B08B 312

US Classification:

134 1

Abstract:

Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

US Patent:

55797920, Dec 3, 1996

Filed:

Feb 9, 1996

Appl. No.:

8/599007

Inventors:

David Stanasolovich - Montgomery NY
William A. Syverson - Colchester VT
Ronald A. Warren - Troy NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B08B 310

US Classification:

134184

Abstract:

Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.