Roy W Brown

US Patent:

46225250, Nov 11, 1986

Filed:

Jul 19, 1985

Appl. No.:

6/756510

Inventors:

Roy B. Brown - Apopka FL

Assignee:

Sawtek, Inc. - Orlando FL

International Classification:

H03H 9145
H03H 942
H03H 976

US Classification:

333151

Abstract:

A surface acoustic wave device in a piezoelectric medium includes input and output transducers for launching and detecting a surface acoustic wave along the piezoelectric medium. The device is arranged in a ring loop to process the bidirectional acoustic wave launched from the input transducer. Multistrip couplers in the ring loop between the input and output transducers are used to achieve low loss characteristics. A phase shift introduced by the multistrip couplers between portions of the surface acoustic wave is used to cancel triple-transit reflections.

US Patent:

54714990, Nov 28, 1995

Filed:

Mar 19, 1993

Appl. No.:

8/034404

Inventors:

Roy B. Brown - Maitland FL
Neal J. Tolar - Longwood FL

International Classification:

H04L 2712

US Classification:

375305

Abstract:

A surface acoustic wave (SAW) device is described that comprises a piezoelectric medium using input and output transducers for launching and detecting a surface acoustic wave on the piezoelectric medium. In particular, a device is described that uses a special combination of transducers for the direct generation of a coded minimum shift keyed (MSK) waveform from an input impulse waveform. The same device is used for the direct detection of an input MSK waveform in order to generate an impulse waveform with sidelobe characteristics similar to those expected from a specific code. The SAW device provides the advantages of MSK encoded waveforms for spread spectrum applications and the advantage of implementing such entirely on a SAW substrate.

US Patent:

58640924, Jan 26, 1999

Filed:

May 16, 1996

Appl. No.:

8/648662

Inventors:

John G. Gore - Sorrento FL
Neal J. Tolar - Longwood FL
Roy B. Brown - Maitland FL
Sunder Gopani - Apopka FL

Assignee:

Sawtek Inc. - Orlando FL

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a multilayer ceramic carrier provides additional electrical contact to a package seal brazed thereto. The vias are positioned between input and output bond pads and connect the metalized protrusion to package ground pads through contact with multiple metalized layers of the package for enhancing the electrical connection between the package Kovar seal ring and customer accessed ground pads. For further suppression of crosstalk, bond pads within the package for connection to the SAW device are spaced at a greater distance from each other than their corresponding pads on the package bottom surface thus maintaining an optimum spacing for package connection to printed circuit board pads for minimizing thermal mismatch effects.

US Patent:

61052264, Aug 22, 2000

Filed:

Jan 25, 1999

Appl. No.:

9/237212

Inventors:

John G. Gore - Sorrento FL
Neal J. Tolar - Longwood FL
Roy B. Brown - Maitland FL
Sunder Gopani - Apopka FL

Assignee:

Sawtek Inc. - Orlando FL

International Classification:

H04R 1700

US Classification:

29 2535

Abstract:

A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a multilayer ceramic carrier provides additional electrical contact to a package seal brazed thereto. The vias are positioned between input and output bond pads and connect the metalized protrusion to package ground pads through contact with multiple metalized layers of the package for enhancing the electrical connection between the package Kovar seal ring and customer accessed ground pads. For further suppression of crosstalk, bond pads within the package for connection to the SAW device are spaced at a greater distance from each other than their corresponding pads on the package bottom surface thus maintaining an optimum spacing for package connection to printed circuit board pads for minimizing thermal mismatch effects.