Roy B Mason

US Patent:

53029232, Apr 12, 1994

Filed:

Jul 16, 1992

Appl. No.:

7/914952

Inventors:

Roy L. Mason - Lake Stevens WA
Paul A. Richer - Snohomish WA
James K. Pietsch - Edmonds WA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01P 100

US Classification:

333 33

Abstract:

An interconnection plate apparatus provides high frequency signal paths for communication among multiple pc boards and/or high frequency system components. The apparatus includes an interconnection plate which is a conductor having cross-sectional channels at which transmission line structures are formed. The transmission line structure includes a through-plate conductor concentrically surrounded by a through-plate insulator concentrically surrounded by the channel walls. An RF ground ring is positioned between the interconnection plate and a pc board at the transmission line structure. The interconnection plate provides a common ground reference and a common ground path for each board mounted to the interconnection plate. The ground ring structures assure a stable ground connection between the interconnection plate and the pc board ground planes. Different transmission line structures implement different signal transformation functions.

Address:

113 SW 306 St, Federal Way, WA 98023

VIN:

KNDJF723377353904

Make:

KIA

Model:

SPORTAGE

Year:

2007