- AUSTIN TX, US Ryan HOOPER - Tempe AZ, US Dwight DANIELS - Chandler AZ, US
International Classification:
H01L 23/495 H01L 23/00
Abstract:
Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
Freescale Semiconductor
Package Development Engineer
Technical Director, Package Innovation
Education:
Arizona State University 2006 - 2009
Master of Science, Masters, Engineering
Arizona State University 2000 - 2003
Bachelor of Science In Engineering, Bachelors, Chemical Engineering
Skills:
Mems Semiconductor Packaging Semiconductor Industry Solidworks Design of Experiments Materials Science Pressure Sensors Accelerometer
Pure Detroit and the staff at the Guardian Building location tried to serve as not only a local source for Detroit-themed items but also as a hub for bankruptcy types looking for cool spots to eat, drink and shop in the city, said Ryan Hooper, creative director for the store.
Date: Nov 08, 2014
Category: U.S.
Source: Google
Inspired by Ben Affleck, Pure Detroit to donate T-shirt proceeds to ALS
Ryan Hooper of Pure Detroit says he was at the Fisher Building location a few weeks ago when Affleck, who is in metro Detroit for the filming of Batman v. Superman: Dawn of Justice, stopped in and purchased a number of items.