Ryan D Linderman

US Patent:

7872867, Jan 18, 2011

Filed:

Sep 2, 2008

Appl. No.:

12/202619

Inventors:

Thomas Brunschwiler - Thalwil, CH
Ryan J. Linderman - Pasadena CA, US
Hugo E. Rothuizen - Adliswil, CH
Reto Waelchli - Zuerich, CH

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361699, 361724, 174 151, 165 804, 165 805, 16510433, 257714

Abstract:

An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.

US Patent:

8363402, Jan 29, 2013

Filed:

Sep 17, 2008

Appl. No.:

12/678298

Inventors:

Thomas J. Brunschwiler - Thalwil, CH
Ryan J. Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361699, 361698, 361718, 361719, 257714, 165 804

Abstract:

The invention relates to an integrated circuit stack () comprising a plurality of integrated circuit layers () and at least one cooling layer () arranged in a space between two circuit layers (). The integrated circuit stack () is cooled using a cooling fluid () pumped through the cooling layer (). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack ().

US Patent:

20100044005, Feb 25, 2010

Filed:

Aug 20, 2008

Appl. No.:

12/194973

Inventors:

Michel Bruno - Zurich, CH
Thomas Brunschwiler - Canton Zurich, CH
Urs Kloter - Dietikon, CH
Ryan J. Linderman - Pasadena CA, US
Erich Ruetsche - Pfaeffikon, CH

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

B60H 1/32

US Classification:

165 44, 62241

Abstract:

A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.

US Patent:

20110036538, Feb 17, 2011

Filed:

Sep 2, 2008

Appl. No.:

12/676398

Inventors:

Thomas J. Brunschwiler - Thalwil, CH
Urs Koter - Dietikon, CH
Ryan Joseph Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH
Reto Waelchli - Zurich, CH

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28F 27/00
F28D 15/00

US Classification:

165 111, 16510431

Abstract:

The invention relates to a cooling arrangement comprising a heat spreader () comprising a first surface (), a second surface (), at least one heat absorption chamber () and at least one heat dissipation chamber (), the at least one heat absorption chamber () being in thermal contact with the first surface () and the at least one heat dissipation chamber () being in thermal contact with the second surface () and hydraulically coupled to the at least one heat absorption chamber (). A cooling fluid () can be driven from the heat absorption chamber () to the heat dissipation chamber () using a plurality of flow patterns for cooling the first surface ().

US Patent:

20120273183, Nov 1, 2012

Filed:

Jul 11, 2012

Appl. No.:

13/546612

Inventors:

Michel Bruno - Zurich, CH
Thomas Brunschwiler - Thalwil, CH
Urs Kloter - Dietikon, CH
Ryan J. Linderman - Pasadena CA, US
Erich Ruetsche - Pfaeffikon, CH

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28F 27/00

US Classification:

165200

Abstract:

A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.

US Patent:

20120331433, Dec 27, 2012

Filed:

Aug 7, 2012

Appl. No.:

13/568720

Inventors:

Thomas J. Brunschwiler - Thalwil, CH
Ryan J. Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

G06F 17/50

US Classification:

716110

Abstract:

The invention relates to an integrated circuit stack () comprising a plurality of integrated circuit layers () and at least one cooling layer () arranged in a space between two circuit layers (). The integrated circuit stack () is cooled using a cooling fluid () pumped through the cooling layer (). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack ().

US Patent:

20150195955, Jul 9, 2015

Filed:

Feb 26, 2015

Appl. No.:

14/632180

Inventors:

- Armonk NY, US
Urs Kloter - Dietikon, CH
Ryan Joseph Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH
Reio Waelchli - Zurich, CH

International Classification:

H05K 7/20

Abstract:

The invention relates to a cooling arrangement comprising a heat spreader () comprising a first surface (), a second surface (), at least one heat absorption chamber () and at least one heat dissipation chamber (), the at least one heat absorption chamber () being in thermal contact with the first surface () and the at least one heat dissipation chamber () being in thermal contact with the second surface () and hydraulically coupled to the at least one heat absorption chamber (). A cooling fluid () can be driven from the heat absorption chamber () to the heat dissipation chamber () using a plurality of flow patterns for cooling the first surface ().

US Patent:

20150176911, Jun 25, 2015

Filed:

Feb 26, 2015

Appl. No.:

14/632194

Inventors:

- Armonk NY, US
Urs Kater - Dietikon, CH
Ryan Joseph Linderman - Pasadena CA, US
Bruno Michel - Zurich, CH
Hugo E. Rothuizen - Adliswil, CH
Reio Waelchli - Zurich, CH

International Classification:

F28D 1/04

Abstract:

The invention relates to a cooling arrangement comprising a heat spreader () comprising a first surface (), a second surface (), at least one heat absorption chamber () and at least one heat dissipation chamber (), the at least one heat absorption chamber () being in thermal contact with the first surface () and the at least one heat dissipation chamber () being in thermal contact with the second surface () and hydraulically coupled to the at least one heat absorption chamber (). A cooling fluid () can be driven from the heat absorption chamber () to the heat dissipation chamber () using a plurality of flow patterns for cooling the first surface ().