Ryan S Riegle

US Patent:

7719108, May 18, 2010

Filed:

Jan 10, 2005

Appl. No.:

11/032526

Inventors:

William E. Murphy - Vestal NY, US
Ryan S. Riegle - Endicott NY, US
Richard Shields - Endwell NY, US
David L. Vos - Apalachin NY, US

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H01L 27/00

US Classification:

257706, 257707, 257710, 257712, 257713, 257783, 2281231, 2281221, 228121, 228120, 438108

Abstract:

A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

US Patent:

7719828, May 18, 2010

Filed:

Jul 22, 2006

Appl. No.:

11/491296

Inventors:

Jonathan M. Brown - Endicott NY, US
Gary Deaton - Vestal NY, US
Ryan S. Riegle - Endicott NY, US

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H05K 5/00
H05K 7/00

US Classification:

36167934, 36167931, 36167933, 36167935, 36167936, 36167937, 36167938, 36167939

Abstract:

A rugged hard disk drive storage assembly is disclosed. The rugged hard disk drive storage assembly includes an enclosure capable of containing multiple hard disk drives. The enclosure also contains multiple shock and vibration absorbers that are configured to elastically support all the hard disk drives contained within the enclosure. The multiple shock absorbers protect the delicate electronic hard disk drives and their sensitive information from shock and vibration damage, even when the enclosure has been removed from the drive container, and is being carried away by personal in a harsh combat environment. In addition, the enclosure is hermetically sealed such that the hard disk drives are isolated from external environment.

US Patent:

20080032455, Feb 7, 2008

Filed:

Oct 16, 2007

Appl. No.:

11/873146

Inventors:

William Murphy - Vestal NY, US
Ryan Riegle - Endicott NY, US
Richard Shields - Endwell NY, US
David Vos - Apalachin NY, US

Assignee:

LOCKHEED MARTIN CORPORATION - Bethesda MD

International Classification:

H01L 21/768

US Classification:

438123000, 257E21575

Abstract:

A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.