Samuel Lee Martin

US Patent:

62115413, Apr 3, 2001

Filed:

Feb 2, 1999

Appl. No.:

9/241458

Inventors:

Michael Scott Carroll - Orlando FL
Tony Georgiev Ivanov - Orlando FL
Samuel Suresh Martin - Gillette NJ

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H01L 27108
H01L 2976
H01L 31119

US Classification:

257275

Abstract:

An article for de-embedding parasitics and/or acting as an on-wafer calibration standard is disclosed. In particular, some articles in accordance with the present invention provide structures on integrated circuits that mitigate the severity of parasitics Furthermore, some articles in accordance with the present invention are well-suited for use with conductive substrates that operate at high frequencies. In an illustrative embodiment, conductive elements are used to construct structures near and/or around the leads on the integrated circuit. When the structures are grounded, the structures function to (at least) partially shield the leads to and from the DUT in a manner that is analogous to stripline, microstrip and coaxial cable. Because the electric fields emanating from the leads terminate in the grounded structure and not in the conductive substrate of the integrated circuit, the severity of the parasitics in the leads in mitigated. An illustrative embodiment of the present invention is an integrated circuit comprising: a first pad, a first lead, a second pad, and a second lead made from a first conductive layer; a substrate; a first plate made from a second conductive layer that is between and electrically insulated from the first lead and the substrate; and a second plate made from the second conductive layer that is between and electrically insulated from the second lead and the substrate.

US Patent:

61947504, Feb 27, 2001

Filed:

Feb 1, 1999

Appl. No.:

9/243377

Inventors:

Michael Scott Carroll - Orlando FL
Tony Georgiev Ivanov - Orlando FL
Samuel Suresh Martin - Gillette NJ

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H01L 2980
H01L 31112

US Classification:

257275

Abstract:

An integrated circuit is disclosed that comprises structures that confine, shield and/or manipulate the electric fields generated within the integrated circuit so as to improve the performance of the integrated circuit. Such structures include, but are not limited to, transmission lines, capacitors, inductors, filters, and couplers. Although embodiments of the present invention are advantageous for use on many integrated circuits, they are particularly well suited for use with integrated circuits that are disposed on conductive substrates and that operate at high frequencies. An illustrative embodiment of the present invention comprises: an integrated circuit comprising: a first lead and a second lead that are made from a first conductive layer; a substrate; a first plate and a second plate that are made from a second conductive layer; wherein said first plate is sandwiched between and electrically insulated from said first lead and said substrate, said second plate is sandwiched between and electrically insulated from said second lead and said substrate, and said first plate and said second plate are electrically connected.