Samuel Kwan Tam

US Patent:

7684689, Mar 23, 2010

Filed:

Sep 15, 2005

Appl. No.:

11/228010

Inventors:

Dongkai Shangguan - San Jose CA, US
Elaine B. Bogue - Dunstable MA, US
Vidyadhar Sitaram Kale - Lake Oswego OR, US
Samuel Waising Tam - Daly City CA, US
Ray H. Morton - New Braunfels TX, US

Assignee:

Flextronics International USA, Inc. - Milpitas CA

International Classification:

G02B 7/04
H04N 5/225

US Classification:

396144, 348340

Abstract:

A digital camera module includes an image capture device, a lens unit, a housing for receiving the lens unit and positioning the lens unit with respect to the image capture device, and a focus mechanism disposed on the outside of the housing and operative to move the lens unit along an axis when the lens unit is rotated about the axis. In one embodiment, the focus mechanism includes a ramp formed on the housing and a complementary ramp formed on the lens unit. In another embodiment, the focus mechanism includes a thread set formed on the outside of the housing for engaging a complementary thread set on a sleeve of the lens unit. In still another embodiment, the focus mechanism includes an inclined groove and a groove follower. The external adjustment mechanism prevents the image capture device from being contaminated by particulates generated during focusing.

US Patent:

7796187, Sep 14, 2010

Filed:

Oct 11, 2005

Appl. No.:

11/247993

Inventors:

Dongkai Shangguan - San Jose CA, US
Vidyadhar Sitaram Kale - Lake Oswego OR, US
Samuel Waising Tam - Daly City CA, US

Assignee:

Flextronics AP LLC - Broomfield CO

International Classification:

H04N 5/225

US Classification:

348374, 348340

Abstract:

An integrated camera module () for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly () is rigidly affixed in relation to a sensor array area () of a camera chip () by a molding (). The molding () is formed on the camera chip (), and optionally on a printed circuit board () on which the camera chip () is mounted. The lens assembly () is held in place in a recess () of the molding () by an adhesive (). The molding () is formed such that a precise gap () exists between the lens assembly () and a sensor array area () of the camera chip (). In a particular embodiment, lens holders () are formed entirely on the camera chips () before or after they are separated from one another.

US Patent:

8092102, Jan 10, 2012

Filed:

May 31, 2006

Appl. No.:

11/444277

Inventors:

Dongkai Shangguan - San Jose CA, US
Samuel Waising Tam - Daly City CA, US

Assignee:

Flextronics AP LLC - Broomfield CO

International Classification:

G03B 17/00

US Classification:

396529, 348340, 359819, 257433

Abstract:

A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

US Patent:

8119450, Feb 21, 2012

Filed:

May 26, 2009

Appl. No.:

12/472083

Inventors:

Nazir Ahmad - San Jose CA, US
Young-Do Kweon - Cupertino CA, US
Samuel Tam - Daly City CA, US
Kyung-Moon Kim - Kyoung ki-do, KR
Rajendra D. Pendse - Fremont CA, US

Assignee:

STATS ChipPAC, Ltd. - Singapore

International Classification:

H01L 21/00
H01L 21/44

US Classification:

438108, 438127, 438615, 438661, 257E23023, 257E23026

Abstract:

A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points. Also, a flip chip package is made by the method. The metallurgical connection includes an alloy of gold and tin at the interface between the bumps and the interconnect points.

US Patent:

8385073, Feb 26, 2013

Filed:

Jul 6, 2010

Appl. No.:

12/831033

Inventors:

Samuel Tam - Daly City CA, US
Younes Shabany - San Jose CA, US

Assignee:

Flextronics AP, LLC - Broomfield CO

International Classification:

H05K 7/20
H05K 3/36

US Classification:

361721, 36167954, 361697, 361702, 361709

Abstract:

A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

US Patent:

8430579, Apr 30, 2013

Filed:

Jan 11, 2011

Appl. No.:

12/930606

Inventors:

Samuel Waising Tam - Daly City CA, US
Tai Wai (David) Pun - Hong Kong, CN
Tak Shing (Dick) Pang - Hong Kong, CN

Assignee:

Flextronics AP, LLC - Broomfield CO

International Classification:

G03B 17/00

US Classification:

396529, 396542

Abstract:

A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.

US Patent:

8642387, Feb 4, 2014

Filed:

Nov 1, 2011

Appl. No.:

13/286366

Inventors:

Samuel Tam - Daly City CA, US
Bryan Lee Sik Pong - Bukit Raja, MY
Dick Pang - Tsuen Wan, HK

Assignee:

Flextronics AP, LLC - Broomfield CO

International Classification:

H01L 21/00
H01L 23/02

US Classification:

438113, 438126, 438127, 257686, 257788, 257E23069, 257E21502

Abstract:

Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

US Patent:

20020014702, Feb 7, 2002

Filed:

Mar 9, 2001

Appl. No.:

09/802375

Inventors:

Nazir Ahmad - San Jose CA, US
Young-Do Kweon - Cupertino CA, US
Samuel Tam - Daly City CA, US
Kyung-Moon Kim - Ichon-si, KR
Rajendra Pendse - Fremont CA, US

International Classification:

H01L029/40
H01L023/52
H01L023/48

US Classification:

257/778000

Abstract:

A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points. Also, a flip chip package is made by the method. In some embodiments the metallurgical connection includes an alloy of gold and tin at the interface between the bumps and the interconnect points.