Sandra Fritz Vos

US Patent:

20120232211, Sep 13, 2012

Filed:

Mar 9, 2012

Appl. No.:

13/416617

Inventors:

Sandra Fritz Vos - Lynchburg VA, US
Thomas Arnold Ebeling - Forest VA, US

International Classification:

C08L 79/08
C08K 7/02
C08L 69/00

US Classification:

524537, 524606, 524612

Abstract:

A fiber-reinforced thermoplastic composite material comprising a fiber-reinforced thermoplastic core material is provided. In some embodiments, the thermoplastic core material has a maximum smoke density Ds (4 minutes) of less than 200 as measured in accordance with ASTM E662, a maximum heat release (5 minutes) of less than 65 kW/m2 as measured in accordance with FAA Heat release test FAR 25.853 (a) Appendix F, Part IV (OSU 65/65), and an average total heat release (2 minutes) of less than 65 kW/m2 as measured in accordance with FAA Heat release test FAR 25.853 (a) Appendix F, Part IV (OSU 65/65).

US Patent:

20140037120, Feb 6, 2014

Filed:

Jul 29, 2013

Appl. No.:

13/953209

Inventors:

Qing Wang - Carol Stream IL, US
Sandra F. Vos - East Dundee IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 23/00

US Classification:

381355

Abstract:

A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.

US Patent:

20100021718, Jan 28, 2010

Filed:

Jul 23, 2008

Appl. No.:

12/220410

Inventors:

Sandra Fritz Vos - Lynchburg VA, US
Thomas Arnold Ebeling - Forest VA, US

International Classification:

B32B 17/10
B32B 7/00

US Classification:

4283159, 4283179

Abstract:

A fiber-reinforced thermoplastic composite material having an advantageous combination of smoke generation, heat release, and mechanical property characteristics. The composite generally comprises a fiber-reinforced thermoplastic core containing discontinuous reinforcing fibers bonded together with one or more thermoplastic resins. The core material may further comprise at least one first skin material applied to a first surface of the core and/or one or more second skin material applied to a second surface of the core material. The thermoplastic core material has a maximum smoke density D(4 minutes) of less than 200 as measured in accordance with ASTM E662, a maximum heat release (5 minutes) of less than 65 kW/mas measured in accordance with FAA Heat release test FAR 25.853 (a) Appendix F, Part IV (OSU 65/65), and an average total heat release (2 minutes) of less than 65 kW/mas measured in accordance with FAA Heat release test FAR 25.853 (a) Appendix F, Part IV (OSU 65/65). The invention is useful in the manufacture of articles for aircraft, automotive, railcar, locomotive, bus, marine, aerospace and construction in which the certain advantages may be provided over other materials utilized for such applications.

US Patent:

20190335262, Oct 31, 2019

Filed:

Apr 24, 2019

Appl. No.:

16/393563

Inventors:

- Itasca IL, US
Sandra Vos - East Dundee IL, US
William Ryan - Itasca IL, US
Yu Du - Itasca IL, US
Jose Salazar - Itasca IL, US
Charles King - Itasca IL, US
Daniel Giesecke - Itasca IL, US

Assignee:

KNOWLES ELECTRONICS, LLC - Itasca IL

International Classification:

H04R 1/08
B81C 1/00
B81B 7/00
H04R 19/01
H04R 31/00
H04R 19/00
H04R 1/04

Abstract:

An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.

US Patent:

20180020275, Jan 18, 2018

Filed:

Jul 13, 2016

Appl. No.:

15/208961

Inventors:

- Itasca IL, US
Wade Conklin - Chicago IL, US
Michael Kuntzman - Chicago IL, US
Sandra Vos - East Dundee IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 1/04
H04R 3/00
H04R 19/00
H04R 19/04

Abstract:

A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.

US Patent:

20160353212, Dec 1, 2016

Filed:

May 24, 2016

Appl. No.:

15/163586

Inventors:

- Itasca IL, US
Sandra F. Vos - East Dundee IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 19/04
H03H 11/04
H04R 19/00

Abstract:

Microphone devices are disclosed. The microphone device includes a base, a lid, a side wall between the base and the lid, and a MEMS die. The side wall includes a first portion with a first width and a second portion with a second width disposed under the first portion. The first width is less than the second width such that a shoulder is formed on the second portion. The MEMS die is supported on the shoulder. The MEMS die includes a diaphragm and a back plate.

US Patent:

20150304753, Oct 22, 2015

Filed:

Jun 30, 2015

Appl. No.:

14/755673

Inventors:

- Itasca IL, US
Ryan M. McCall - San Jose CA, US
Daniel Giesecke - West Chicago IL, US
Sandra F. Vos - East Dundee IL, US
John B. Szczech - Schaumburg IL, US
Sung Bok Lee - Chicago IL, US
Peter Van Kessel - Downers Grove IL, US

International Classification:

H04R 1/08

Abstract:

A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.