Sanjeev Gupta

US Patent:

20220404474, Dec 22, 2022

Filed:

Dec 21, 2021

Appl. No.:

17/558201

Inventors:

- Santa Clara CA, US
Guiyun Bai - Chandler AZ, US
Israel Petronius - Haifa, IL
Sushrutha Gujjula - Chandler AZ, US
Ronald L. Spreitzer - Phoenix AZ, US
Kenneth Brown - Tempe AZ, US
Konstantin Matyuch - Netanya, IL
Boping Xie - San Ramon CA, US
Stephen Keele - Hew Holland PA, US
Qifeng Wu - Hillsboro OR, US
Ankur Agrawal - Chandler AZ, US
Jonathan Doylend - Morgan Hill CA, US
Sanjeev Gupta - Santa Rosa CA, US
Sam Khalili - San Jose CA, US
Daniel Grodensky - Haifa, IL
Nan Kong Ng - Kulim, MY
Ron Friedman - Givat Oz, IL
Gal Dvoretzki - Hod Hasharon, IL

International Classification:

G01S 7/481
G01S 17/931
G02B 6/42

Abstract:

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

US Patent:

20220390562, Dec 8, 2022

Filed:

Dec 21, 2021

Appl. No.:

17/557290

Inventors:

Guiyun Bai - Chandler AZ, US
Sushrutha Gujjula - Chandler AZ, US
Ronald L. Spreitzer - Phoenix AZ, US
Naresh Satyan - Pasadena CA, US
David Mathine - ALBUQUERQUE NM, US
Sam Khalili - San Jose CA, US
Sanjeev Gupta - Santa Rosa CA, US
Eleanor Patricia Paras Rabadam - Folsom CA, US
Ankur Agrawal - Chandler AZ, US
Kenneth Brown - Mesa AZ, US
Jonathan Doylend - Morgan Hill CA, US
Daniel Grodensky - Haifa, IL
Israel Petronius - Haifa, IL

International Classification:

G01S 7/481
B81B 7/02
G01S 17/931

Abstract:

Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.