Scott B Charles

US Patent:

6528169, Mar 4, 2003

Filed:

Jun 25, 2001

Appl. No.:

09/888921

Inventors:

Scott B. Charles - Hudson WI
Robert J. Kinney - Woodbury MN
Michael A. Kropp - Cottage Grove MN
Roger A. Mader - Stillwater MN

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

B32B 2738

US Classification:

428414, 428413, 156330, 523400, 525523, 525529, 525530

Abstract:

The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

US Patent:

7327039, Feb 5, 2008

Filed:

May 20, 2003

Appl. No.:

10/441879

Inventors:

Scott B. Charles - Hudson WI, US
Kathleen M. Gross - Woodbury MN, US
Steven C. Hackett - Oakdale MN, US
Michael A. Kropp - Cottage Grove MN, US
William J. Schultz - North Oaks MN, US
Wendy L. Thompson - Roseville MN, US

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

257778, 257789, 257795, 257786, 257E23015, 257E2304

Abstract:

The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

US Patent:

7482201, Jan 27, 2009

Filed:

Jan 11, 2008

Appl. No.:

11/972904

Inventors:

Scott B. Charles - Hudson WI, US
Kathleen M. Gross - Woodbury MN, US
Steven C. Hackett - Oakdale MN, US
Michael A. Kropp - Cottage Grove MN, US
William J. Schultz - North Oaks MN, US
Wendy L. Thompson - Roseville MN, US

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

438108, 438118, 438613

Abstract:

The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

US Patent:

20030111519, Jun 19, 2003

Filed:

Sep 4, 2001

Appl. No.:

09/946013

Inventors:

Robert Kinney - Woodbury MN, US
Michael Kropp - Cottage Grove MN, US
Scott Charles - Hudson WI, US

Assignee:

3M Innovative Properties Company

International Classification:

B23K001/20
B23K031/02
B23K035/34

US Classification:

228/223000, 228/180220, 148/023000

Abstract:

The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.

US Patent:

20100214732, Aug 26, 2010

Filed:

Feb 12, 2010

Appl. No.:

12/705008

Inventors:

Scott B. CHARLES - Spring Valley WI, US
Michael A. Kropp - Cottage Gove MN, US
Ashu N. Mujumdar - Woodbury MN, US

International Classification:

G06F 1/16
B29C 67/24
C08J 5/00
B29C 35/08
B29C 39/00
H05K 5/00

US Classification:

36167933, 264330, 26433115, 264496, 26433114, 174 50

Abstract:

This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.

US Patent:

20130235515, Sep 12, 2013

Filed:

Nov 2, 2011

Appl. No.:

13/885409

Inventors:

Andrew J. Ouderkirk - St. Paul MN, US
Scott B. Charles - Spring Valley WI, US
Stanley C. Busman - North St. Paul MN, US

Assignee:

3M INNOVATIVE PROPERTIES COMPANY - St. Paul MN

International Classification:

H05K 7/02
H05K 13/00

US Classification:

36167901, 522170, 522182, 522 81, 523400, 524560, 1562755

Abstract:

An electronic display () is provided that includes a display panel () having an image—forming region, a substantially clear photocured bonding layer () which is the reaction product of a first photocurable resin system disposed upon the image—forming region, an obscuring layer () in proximity to at least a portion of the substantially clear photocurable bonding layer, and a substantially transparent outer panel () in contact with at least a portion of the obscuring layer. The bonding layer () is disposed partially beneath the obscuring layer (). The obscuring layer has an average light transmission of less than about 5% in the wavelength range of 420 nm to 700 nm and a light transmission of greater than about 5% in the wavelength range of 300 to 400 nm. Also provided is a method for making the electronic display.

US Patent:

6294259, Sep 25, 2001

Filed:

Jul 6, 2000

Appl. No.:

9/611450

Inventors:

Gregory J. Anderson - Stillwater MN
Scott B. Charles - Hudson WI
Michael A. Kropp - Cottage Grove MN

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

B32B 2738

US Classification:

428413

Abstract:

This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (M. sub. n) having repeating units of Formula (1): ##STR1## The adhesives are particularly useful in applications where thermal stability and high adhesive strength are required.

US Patent:

20200283619, Sep 10, 2020

Filed:

Dec 21, 2018

Appl. No.:

16/756518

Inventors:

- St. Paul MN, US
John C. Clark - Maplewood MN, US
Eric G. Larson - Lake Elmo MN, US
Jeremy M. Higgins - Roseville MN, US
Audrey S. Forticaux - Minneapolis MN, US
Jay R. Lomeda - St. Paul MN, US
Wayne S. Mahoney - St. Paul MN, US
Scott B. Charles - Spring Valley WI, US
Timothy D. Fletcher - Lino Lakes MN, US
Wendy L. Thompson - Roseville MN, US
Kyle R. Schwartz - Maplewood MN, US

International Classification:

C08L 63/00
H05K 5/02
C08K 3/22
C08K 7/20
C08K 3/14
C08K 3/38

Abstract:

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.