Scott R Estes

US Patent:

53929802, Feb 28, 1995

Filed:

Dec 29, 1993

Appl. No.:

8/175030

Inventors:

Deepak N. Swamy - Austin TX
Scott Estes - Austin TX
James Bell - Cedar Park TX

Assignee:

Dell USA, L.P. - Austin TX

International Classification:

H01L 2160

US Classification:

228119

Abstract:

A rework process for ball grid array (BGA) packages which allows for reuse of devices that have been removed for lack of integrity of solder interconnections. The process uses a rework tool which comprises a plate including one or more depressions corresponding to the contours of inverted BGA packages. A BGA package to be reworked is placed in a respective depression with what remains of the original solder ball grid facing upward. The residual solder balls are wicked away, thus leaving the BGA package with the pads that the solder balls were attached to being exposed. A stencil with BGA patterns punched into it is then placed over the rework tool and solder paste is screened onto the rework tool so that the solder is deposited on the BGA pads via the openings in the stencil. The entire fixture is then subjected to a reflow process to cause the solder to ball up during this process. After the reflow process has completed, the stencil is removed, leaving behind a ball grid array similar to that found in the original package.

US Patent:

56138580, Mar 25, 1997

Filed:

Jul 18, 1996

Appl. No.:

8/683179

Inventors:

Scott H. Estes - Austin TX
N. Deepak Swamy - Austin TX

Assignee:

Dell U.S.A., L.P. - Austin TX

International Classification:

H01R 2900

US Classification:

439 46

Abstract:

A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.

US Patent:

57147892, Feb 3, 1998

Filed:

Nov 22, 1996

Appl. No.:

8/755388

Inventors:

Scott Estes - Austin TX
Deepak Swamy - Austin TX

Assignee:

Dell U.S.A., L.P. - Austin TX

International Classification:

H01L 2714

US Classification:

257414

Abstract:

In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.

US Patent:

59465441, Aug 31, 1999

Filed:

Nov 22, 1996

Appl. No.:

8/754965

Inventors:

Scott Estes - Austin TX
Deepak Swamy - Austin TX

Assignee:

Dell USA, L.P. - Round Rock TX

International Classification:

H01L 2152
H01L 2154
H01L 2158

US Classification:

438 15

Abstract:

In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.

US Patent:

56252277, Apr 29, 1997

Filed:

Jan 18, 1995

Appl. No.:

8/374320

Inventors:

Scott Estes - Austin TX
Deepak Swamy - Austin TX

Assignee:

Dell USA, L.P. - Austin TX

International Classification:

H01L 2334

US Classification:

257712

Abstract:

In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.