Scott P Ferguson

US Patent:

6867983, Mar 15, 2005

Filed:

Aug 7, 2002

Appl. No.:

10/214066

Inventors:

Peikang Liu - Claremont CA, US
Scott Wayne Ferguson - Arcadia CA, US
Dave N. Edwards - Arcadia CA, US
Yukihiko Sasaki - Claremont CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H05K005/00
B41M003/12
H01L023/495

US Classification:

361761, 361737, 361766, 428901, 257673, 257692, 257735

Abstract:

A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.

US Patent:

6940408, Sep 6, 2005

Filed:

Dec 31, 2002

Appl. No.:

10/334290

Inventors:

Scott Wayne Ferguson - Arcadia CA, US
David N. Edwards - Arcadia CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B013/14

US Classification:

3405727, 340572, 343873, 343895, 257673

Abstract:

A radio frequency identification (RFID) inlay includes a conductive connection electrically connecting an antenna to strap leads that are coupled to an RFID chip. The conductive connection may include conductive bumps attached to the strap, and/or may include conductive traces, such as a conductive ink traces. The conductive connections provide a convenient, fast, and effective way to operatively couple antennas and straps. The RFID inlay may be part of an RFID label or RFID tag.

US Patent:

7120987, Oct 17, 2006

Filed:

Aug 5, 2003

Appl. No.:

10/634243

Inventors:

Peikang Liu - Claremont CA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Garden Grove CA, US
Scott Wayne Ferguson - Arcadia CA, US
Jason D. Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 13/00
H01Q 1/38

US Classification:

29600, 29825, 29832, 29601, 295921, 343867, 343700 MS, 3405727

Abstract:

A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

US Patent:

7158037, Jan 2, 2007

Filed:

Mar 22, 2004

Appl. No.:

10/805938

Inventors:

Ian J. Forster - Chelmsford, GB
Scott Wayne Ferguson - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405728, 3405721, 29829

Abstract:

A web of radio frequency identification (RFID) devices includes a conductive layer atop an insulating layer, the conductive layer having one or more apertures therein. Alternatively, the web may not include an insulating layer. RFID chips or straps are electrically coupled to portions of the conductive layer on either side of an aperture, for use as antennas when the RFID devices are separated from one another, as by cutting. The apertures may be formed by creasing portions of the web, and removing parts of the creased portion. There may be one or more apertures in a longitudinal or transverse direction of the web. The antenna shapes of various of the RFID devices may be tessellated, nesting within one another or having the same boundary, thereby improving efficiency by using substantially all of the conductive material. The RFID devices may be tested and/or programmed while remaining in the web format.

US Patent:

7224280, May 29, 2007

Filed:

Jun 18, 2004

Appl. No.:

10/871169

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
David N. Edwards - La Canada CA, US
Peikang Liu - Claremont CA, US
Jason Munn - West Covina CA, US
Ian J. Forster - Chelmsford, GB
Samuel A. Linder - Moore SC, US
Thomas Craig Weakley - Simpsonville SC, US
David Puleston - Duluth GA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Grove CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 13/14

US Classification:

3405727, 343873, 343895

Abstract:

A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.

US Patent:

7333061, Feb 19, 2008

Filed:

Sep 13, 2006

Appl. No.:

11/520077

Inventors:

Peikang Liu - Claremont CA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Garden Grove CA, US
Scott Wayne Ferguson - Arcadia CA, US
Jason D. Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 1/38

US Classification:

343700MS, 343767

Abstract:

A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

US Patent:

7571862, Aug 11, 2009

Filed:

Jun 2, 2005

Appl. No.:

11/144470

Inventors:

Ian James Forster - Chelmsford, GB
Scott Wayne Ferguson - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G06K 19/06
G06K 19/00
G06K 5/00
G06K 15/00
G08B 13/14
H04Q 5/22

US Classification:

235492, 235487, 235380, 235383, 235493, 3405721, 3405728, 340 101

Abstract:

A radio-frequency identification (RFID) tag includes a face stock and an RFID device. The face stock has a printable side and an inlay side, with the RFID device mounted to the inlay side. A layer of adhesive is coated on the inlay side of the face stock. A liner is releasably adhered to the layer of adhesive and includes a relief area that accommodates for defection of the RFID device. The accommodation of the thickness of the RFID device results in a tag that has a substantially uniform printable surface. Accordingly, when passing through a printer, the printable surface is maintained substantially flat or linear at the print head of the printer, thereby minimizing jamming and enhancing printability. A pinch roller for a printer also accommodates for deflection of the RFID tag by providing a deformable section along a length thereof the body that has a greater resiliency than the rest of the body. At the location of the RFID device, the layer of adhesive may also include a blank that is substantially free of adhesive for accommodating the RFID device.

US Patent:

7623034, Nov 24, 2009

Filed:

Jun 9, 2005

Appl. No.:

11/148676

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
Ralf Linkmann - Biebertal, DE
Werner Kiehne - Herborn, DE

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405721, 3405724, 3405728, 29601, 29832, 29834, 29836

Abstract:

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.