Scott M Ferguson

US Patent:

7158037, Jan 2, 2007

Filed:

Mar 22, 2004

Appl. No.:

10/805938

Inventors:

Ian J. Forster - Chelmsford, GB
Scott Wayne Ferguson - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405728, 3405721, 29829

Abstract:

A web of radio frequency identification (RFID) devices includes a conductive layer atop an insulating layer, the conductive layer having one or more apertures therein. Alternatively, the web may not include an insulating layer. RFID chips or straps are electrically coupled to portions of the conductive layer on either side of an aperture, for use as antennas when the RFID devices are separated from one another, as by cutting. The apertures may be formed by creasing portions of the web, and removing parts of the creased portion. There may be one or more apertures in a longitudinal or transverse direction of the web. The antenna shapes of various of the RFID devices may be tessellated, nesting within one another or having the same boundary, thereby improving efficiency by using substantially all of the conductive material. The RFID devices may be tested and/or programmed while remaining in the web format.

US Patent:

7224280, May 29, 2007

Filed:

Jun 18, 2004

Appl. No.:

10/871169

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
David N. Edwards - La Canada CA, US
Peikang Liu - Claremont CA, US
Jason Munn - West Covina CA, US
Ian J. Forster - Chelmsford, GB
Samuel A. Linder - Moore SC, US
Thomas Craig Weakley - Simpsonville SC, US
David Puleston - Duluth GA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Grove CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 13/14

US Classification:

3405727, 343873, 343895

Abstract:

A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.

US Patent:

7571862, Aug 11, 2009

Filed:

Jun 2, 2005

Appl. No.:

11/144470

Inventors:

Ian James Forster - Chelmsford, GB
Scott Wayne Ferguson - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G06K 19/06
G06K 19/00
G06K 5/00
G06K 15/00
G08B 13/14
H04Q 5/22

US Classification:

235492, 235487, 235380, 235383, 235493, 3405721, 3405728, 340 101

Abstract:

A radio-frequency identification (RFID) tag includes a face stock and an RFID device. The face stock has a printable side and an inlay side, with the RFID device mounted to the inlay side. A layer of adhesive is coated on the inlay side of the face stock. A liner is releasably adhered to the layer of adhesive and includes a relief area that accommodates for defection of the RFID device. The accommodation of the thickness of the RFID device results in a tag that has a substantially uniform printable surface. Accordingly, when passing through a printer, the printable surface is maintained substantially flat or linear at the print head of the printer, thereby minimizing jamming and enhancing printability. A pinch roller for a printer also accommodates for deflection of the RFID tag by providing a deformable section along a length thereof the body that has a greater resiliency than the rest of the body. At the location of the RFID device, the layer of adhesive may also include a blank that is substantially free of adhesive for accommodating the RFID device.

US Patent:

7623034, Nov 24, 2009

Filed:

Jun 9, 2005

Appl. No.:

11/148676

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
Ralf Linkmann - Biebertal, DE
Werner Kiehne - Herborn, DE

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405721, 3405724, 3405728, 29601, 29832, 29834, 29836

Abstract:

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

US Patent:

8067253, Nov 29, 2011

Filed:

Dec 21, 2005

Appl. No.:

11/314988

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
Ali Mehrabi - Glendale CA, US
Reza Mehrabi - Tujunga CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01L 21/00

US Classification:

438 26, 438 64, 257E31117

Abstract:

An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

US Patent:

8072333, Dec 6, 2011

Filed:

May 23, 2007

Appl. No.:

11/752482

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
David N. Edwards - La Canada CA, US
Peikang Liu - Claremont CA, US
Jason Munn - West Covina CA, US
Ian J. Forster - Chelmsford, GB
Samuel A. Linder - Moore SC, US
Thomas Craig Weakley - Simpsonville SC, US
David Puleston - Duluth GA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Garden Grove CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405727, 3405721, 3405724, 3405728, 235492, 343702, 29829

Abstract:

A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

US Patent:

8083151, Dec 27, 2011

Filed:

Apr 28, 2009

Appl. No.:

12/430920

Inventors:

Ian James Forster - Essex, GB
Scott Wayne Ferguson - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G06K 19/00
G06K 19/06
G06K 7/10
G08B 13/14

US Classification:

235492, 235487, 23547202, 3405721, 3405728

Abstract:

A radio-frequency identification (RFID) tag includes a face stock and an RFID device. The face stock has a printable side and an inlay side, with the RFID device mounted to the inlay side. A layer of adhesive is coated on the inlay side of the face stock. A liner is releasably adhered to the layer of adhesive and includes a relief area that accommodates for defection of the RFID device. The accommodation of the thickness of the RFID device results in a tag that has a substantially uniform printable surface. Accordingly, when passing through a printer, the printable surface is maintained substantially flat or linear at the print head of the printer, thereby minimizing jamming and enhancing printability. A pinch roller for a printer also accommodates for deflection of the RFID tag by providing a deformable section along a length thereof the body that has a greater resiliency than the rest of the body. At the location of the RFID device, the layer of adhesive may also include a blank that is substantially free of adhesive for accommodating the RFID device.

US Patent:

8531297, Sep 10, 2013

Filed:

Oct 28, 2009

Appl. No.:

12/607534

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
Ralf Linkmann - Biebertal, DE
Werner Kiehne - Herborn, DE

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G08B 13/14

US Classification:

3405721, 3405724, 3405728, 29601, 29832, 29834, 29836

Abstract:

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.