Scott W Hendrickson

US Patent:

6374831, Apr 23, 2002

Filed:

Feb 4, 1999

Appl. No.:

09/246036

Inventors:

Shankar N. Chandran - Milpitas CA
Scott Hendrickson - San Jose CA
Gwendolyn D. Jones - Sunnyvale CA
Shankar Venkataraman - Santa Clara CA
Ellie Yieh - Millbrae CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B08B 700

US Classification:

134 11, 134 1, 134 221, 134 2218, 134902, 438905

Abstract:

A method and apparatus that reduces the time required to clean a processing chamber employing a reactive plasma cleaning process. A plasma is formed in an Astron fluorine source generator from a flow of substantially pure inert-source gas. After formation of the plasma, a flow of a fluorine source gas is introduced therein such that the fluorine source flow accelerates at a rate no greater than 1. 67 standard cubic centimeters per second (scc/s ). In this fashion, the plasma contains a plurality of radicals and dissociated inert-source gas atoms, defining a cleaning mixture. The ratio of inert-source gas to fluorine source is greater than 1:1.

US Patent:

6495233, Dec 17, 2002

Filed:

Jul 5, 2000

Appl. No.:

09/609994

Inventors:

Inna Shmurun - Foster City CA
Scott Hendrickson - Brentwood CA
Gwendolyn Jones - Roseville CA
Shankar Venkataraman - Santa Clara CA
Son T. Nguyen - San Jose CA
I-Chun Eugenia Liu - Sunnyvale CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B32B 302

US Classification:

428 641, 428 661, 428 666, 118715, 118718, 118720, 118713, 118723 T, 118723 IR, 118723 E, 118723 R, 118723 ER, 118724, 118725

Abstract:

A lid assembly for a semiconductor processing apparatus having at least two chambers comprises a lid plate having a first side and a second side and a plasma generation source mounted to the first side of the lid plate. Additionally, at least two gas boxes are coupled to the first side of the lid of the lid plate, and a divider is coupled between the plasma generation source and the at least two gas boxes.

US Patent:

6814087, Nov 9, 2004

Filed:

Apr 3, 2002

Appl. No.:

10/115665

Inventors:

Shankar W. Chandran - Milpitas CA
Scott Hendrickson - San Jose CA
Gwendolyn D. Jones - Sunnyvale CA
Shankar Venkataraman - Santa Clara CA
Ellie Yieh - Millbrae CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B08B 700

US Classification:

134 11, 134 1, 134 221, 134 2218

Abstract:

A method of removing residue from a substrate processing chamber. In one embodiment the method comprises flowing an inert gas into a remote plasma chamber and forming a plasma within the chamber; maintaining the plasma while creating a plurality of reactive fluorine species by flowing a fluorine-containing gas into the remote plasma chamber and increasing a flow rate of a fluorine-containing gas from a first flow rate to a second flow rate higher than the first flow rate; and introducing the plurality of reactive fluorine species into the substrate processing chamber.

US Patent:

7566891, Jul 28, 2009

Filed:

Mar 15, 2007

Appl. No.:

11/686878

Inventors:

Juan Carlos Rocha-Alvarez - Sunnyvale CA, US
Thomas Nowak - Cupertino CA, US
Dale R. Du Bois - Los Gatos CA, US
Sanjeev Baluja - San Francisco CA, US
Scott A. Hendrickson - Brentwood CA, US
Dustin W. Ho - Fremont CA, US
Andrzei Kaszuba - San Jose CA, US
Tom K. Cho - Palo Alto CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 21/00
G01N 21/33
B01J 19/08
B29C 35/08

US Classification:

250504R, 250365, 25049212, 2504922, 2504931

Abstract:

Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

US Patent:

7663121, Feb 16, 2010

Filed:

Jun 15, 2006

Appl. No.:

11/424368

Inventors:

Thomas Nowak - Sunnyvale CA, US
Juan Carlos Rocha-Alvarez - Cupertino CA, US
Andrzej Kaszuba - San Jose CA, US
Scott A. Hendrickson - Brentwood CA, US
Dustin W. Ho - Fremont CA, US
Sanjeev Baluja - San Francisco CA, US
Tom Cho - Palo Alto CA, US
Josephine Chang - Sunnyvale CA, US
Hichem M'Saad - Santa Clara CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 23/00

US Classification:

25045511, 250504 R, 25045311

Abstract:

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.

US Patent:

7777198, Aug 17, 2010

Filed:

Mar 15, 2007

Appl. No.:

11/686881

Inventors:

Juan Carlos Rocha-Alvarez - Sunnyvale CA, US
Thomas Nowak - Cupertino CA, US
Dale R. Du Bois - Los Gatos CA, US
Sanjeev Baluja - San Francisco CA, US
Scott A. Hendrickson - Brentwood CA, US
Dustin W. Ho - Fremont CA, US
Andrzei Kaszuba - San Jose CA, US
Tom K. Cho - Palo Alto CA, US

Assignee:

Applied Materials, Inc. - Snata Clara CA

International Classification:

H01J 37/20

US Classification:

25045511, 2504921, 2504931, 250504 R, 362294, 362341, 362321, 362345, 118620, 118641, 118642

Abstract:

Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

US Patent:

8203126, Jun 19, 2012

Filed:

Jul 22, 2010

Appl. No.:

12/841935

Inventors:

Juan Carlos Rocha-Alvarez - San Carlos CA, US
Thomas Nowak - Cupertino CA, US
Dale R. Du Bois - Los Gatos CA, US
Sanjeev Baluja - Sunnyvale CA, US
Scott A. Hendrickson - Brentwood CA, US
Dustin W. Ho - Fremont CA, US
Andrzei Kaszuba - San Jose CA, US
Tom K. Cho - Los Altos Hills CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 21/00
G01N 21/33
B01J 19/08
B29C 35/08

US Classification:

250504R, 250365, 2504921, 2504922, 2504931

Abstract:

Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

US Patent:

20060249175, Nov 9, 2006

Filed:

Sep 20, 2005

Appl. No.:

11/230975

Inventors:

Thomas Nowak - Sunnyvale CA, US
Juan Rocha-Alvarez - Cupertino CA, US
Andrzej Kaszuba - San Jose CA, US
Scott Hendrickson - Brentwood CA, US
Dustin Ho - Fremont CA, US
Sanjeev Baluja - San Francisco CA, US
Tom Cho - Palo Alto CA, US
Josephine Chang - Sunnyvale CA, US
Hichem M'Saad - Santa Clara CA, US

International Classification:

B08B 3/12
B08B 7/00
B08B 9/00
H01L 21/306

US Classification:

134001000, 134019000, 134022100, 156345100, 156345290

Abstract:

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.