Scott G Hess

US Patent:

20020164892, Nov 7, 2002

Filed:

Apr 24, 2002

Appl. No.:

10/131344

Inventors:

Nelson Garcia - Lake in the Hills IL, US
Richard Rehak - Crystal Lake IL, US
Chris Caramela - Crystal Lake IL, US
Scott Hess - Lake in the Hills IL, US

Assignee:

Coilcraft, Incorporated

International Classification:

H01R011/30
H01R013/60

US Classification:

439/038000

Abstract:

A low profile electronic component in accordance with the invention includes an elongated core made from a magnetic material such as ferrite, which is connected to a base having a plurality of metalized pads attached thereto for electrically and mechanically connecting the component to a printed circuit board. Support structures or spacers are positioned at the ends of the core and are provided to assist the core in shielding the component and concentrating its magnetic lines of flux. The component also includes a winding of wire wound about at least a portion of the base and core assembly between the supports, and has the ends of the wire electrically and mechanically connected to the metalized pads of the base. A top portion may be coupled to the core via the supports to cover at least a portion of the windings of wire of the component. The supports separate the core and the top portion and maintain the top portion at a desired position with respect to the winding and the core. The core, supports, and top portion provide a source of additional shielding for the component and improve the performance of the overall component by concentrating the lines of flux emitted by the component thereby increasing the flux density of the component and its inductance.

US Patent:

20050145408, Jul 7, 2005

Filed:

Dec 3, 2004

Appl. No.:

11/003082

Inventors:

Scott Hess - Lake in the Hills IL, US

International Classification:

H02G003/08

US Classification:

174052100

Abstract:

A low profile surface mountable inductive component having an elongated core having first and second ends and first and second supports for supporting the core. Metalized pads are provided on the supports for electrically connecting and mounting the supports to a printed circuit board, and a wire is wound about at least a portion of the core with the wire ends being electrically connected to the metalized pads of the supports. In one form, the core and supports define a chip form having a length ranging from 0.2 mm to 0.8 mm, a width ranging from 0.1 mm to 0.6 mm, and a height ranging from 0.2 mm to 0.6 mm. In another form, the component has a cover covering at least a portion of the wire winding and the component has a length ranging from 0.2 mm to 1.0 mm, a width ranging from 0.2 mm to 0.7 mm, and a height ranging from 0.2 mm to 0.7 mm.

US Patent:

20080036566, Feb 14, 2008

Filed:

Aug 8, 2007

Appl. No.:

11/836043

Inventors:

Andrzej Klesyk - Lake In The Hills IL, US
Scott D. Hess - Crystal Lake IL, US
Lawrence B. Lestarge - Algonquin IL, US

International Classification:

H01F 27/36
H01F 41/06

US Classification:

336 84 M, 29605

Abstract:

An electronic component including a core having a wire wound around a portion of the core with first and second ends being connected to terminals for mounting the component to corresponding lands in a circuit. The component having an outer body made of a mixture of magnetic and/or non-magnetic material and a binder which can either be potted and cured or compression molded. The mixture encasing at least a portion of the core and wire and leaving at least a portion of the terminals exposed for mounting the component to the circuit using conventional pick-and-place equipment. Further, methods of manufacturing such components and customizing same are disclosed.

US Patent:

20110005064, Jan 13, 2011

Filed:

Sep 17, 2010

Appl. No.:

12/885045

Inventors:

Andrzej Klesyk - Lake in The Hills IL, US
Scott D. Hess - Crystal Lake IL, US
Lawrence B. Lestarge - Algonquin IL, US

Assignee:

Coilcraft, Incorporated - Cary IL

International Classification:

H01F 41/06

US Classification:

29605

Abstract:

An electronic component including a core having a wire wound around a portion of the core with first and second ends being connected to terminals for mounting the component to corresponding lands in a circuit. The component having an outer body made of a mixture of magnetic and/or non-magnetic material and a binder which can either be potted and cured or compression molded. The mixture encasing at least a portion of the core and wire and leaving at least a portion of the terminals exposed for mounting the component to the circuit using conventional pick-and-place equipment. Further, methods of manufacturing such components and customizing same are disclosed.

US Patent:

20190287707, Sep 19, 2019

Filed:

Jun 7, 2019

Appl. No.:

16/434758

Inventors:

- Cary IL, US
Scott D. Hess - Crystal Lake IL, US
Lawrence B. Lestarge - Algonquin IL, US

International Classification:

H01F 27/04
H01F 27/29
H01F 27/02
H01F 27/24
H01F 27/28

Abstract:

An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.

US Patent:

20160196914, Jul 7, 2016

Filed:

Mar 11, 2016

Appl. No.:

15/067375

Inventors:

- Cary IL, US
Scott D. Hess - Crystal Lake IL, US
Lawrence B. Lestarge - Algonquin IL, US

International Classification:

H01F 27/04
H01F 27/28
H01F 27/24
H01F 27/29

Abstract:

An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.