Scott A Jacobs

US Patent:

48289647, May 9, 1989

Filed:

Sep 4, 1987

Appl. No.:

7/093360

Inventors:

William R. Brunsvold - Poughkeepsie NY
Willard E. Conley - Cornwall NY
Scott L. Jacobs - Apex NC
George L. Mack - Pleasant Valley NY
David P. Merritt - Cold Spring NY
Ann M. Uptmor - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 190
G03C 516

US Classification:

430271

Abstract:

A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling point greater than 160. degree. C. and a low boiling organic compound (70. degree. -150. degree. C. ) may be incorporated in the composition.

US Patent:

48665070, Sep 12, 1989

Filed:

May 19, 1986

Appl. No.:

6/864228

Inventors:

Scott L. Jacobs - Peekskill NY
Perwaiz Nihal - Hopewell Junction NY
Burhan Ozmat - Peekskill NY
Henri D. Schnurmann - Monsey NY
Arthur R. Zingher - White Plains NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2302

US Classification:

357 74

Abstract:

An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i. e. , silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i. e. , thin film copper of approximately 5 microns), semiconductor integrated circuit chips connected to the upper-most patterned conductive layer, and means to connected the packaging structure to the next level of packaging (i. e. , board or card). The thin film wiring layers typically each having coplanar ground, power and signal lines, with at least one power or ground line existing between coplanar signal lines to minimize cross talk. To facilitate efficient power distribution, lines of specific power levels of the patterned planes are connected to lines of the same power level on other patterned planes to form three dimensional power planes. To reduce package capacitance and keep the RC constant low, a personalized reference plane is incorporated.