Scott D Mcclurg

US Patent:

49977920, Mar 5, 1991

Filed:

Nov 21, 1989

Appl. No.:

7/439919

Inventors:

Scott D. McClurg - Rochester NY

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

H01L 21302

US Classification:

437226

Abstract:

Rather than being separated along a single cleavage line between their adjacent ends, diode arrays are spaced apart on a fabrication wafer to allow parallel cleavage lines to be established between the ends of each adjacent pair of arrays by scribed grooves located along opposite sides of a narrow disposable strip of water material. A cleaving technique substantially insures that any projecting lip along the cleavage plane will be on the disposable strip rather than on a diode chip, so that such a defect cannot interfere with proper end-to-end spacing of the chips when they are subsequently assembled to provide a continuous row of chips with uniformly spaced individual light-emitting sites.

US Patent:

49977938, Mar 5, 1991

Filed:

Nov 21, 1989

Appl. No.:

7/439920

Inventors:

Scott D. McClurg - Rochester NY

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

H01L 21302
H01L 21304

US Classification:

437226

Abstract:

A relatively wide scribing channel is provided between the ends of each adjacent pair of diode array areas on a wafer to expose the epitaxial layer of the wafer. A scribing groove is then scribed in the scribing channel to define a cleavage line along which the array areas are separated.

US Patent:

53008065, Apr 5, 1994

Filed:

Mar 1, 1991

Appl. No.:

7/662865

Inventors:

Scott D. McClurg - Rochester NY

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

H01L 3300
H01L 2906
H01L 2710

US Classification:

257594

Abstract:

Rather than being separated along a single cleavage line between their adjacent ends, diode arrays are spaced apart on a fabrication wafer to allow parallel cleavage lines to be established between the ends of each adjacent pair of arrays by scribed grooves located along opposite sides of a narrow disposable strip of wafer material. A cleaving technique substantially insures that any projecting lip along the cleavage plane will be on the disposable strip rather than on a diode chip, so that such a defect cannot interfere with proper end-to-end spacing of the chips when they are subsequently assembled to provide a continuous row of chips with uniformly spaced individual light-emitting sites.

US Patent:

50538365, Oct 1, 1991

Filed:

Mar 1, 1991

Appl. No.:

7/662866

Inventors:

Scott D. McClurg - Rochester NY

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

H01L 3300

US Classification:

357 17

Abstract:

A relatively wide scribing channel is provided between the ends of each adjacent pair of diode array areas on a wafer to expose the epitaxial layer of the wafer. A scribing groove is then scribed in the scribing channel to define a cleavage line along which the array areas are separated.