Scott A Mcdaniel

US Patent:

7373526, May 13, 2008

Filed:

Apr 24, 2002

Appl. No.:

10/131623

Inventors:

Andrew S. Hwang - Redondo Beach CA, US
Andrew M. Naylor - Santa Ana CA, US
Steven B. Lindsay - Mission Viejo CA, US
Habib Anthony Abouhossein - Corona Del Mar CA, US
Scott Sterling McDaniel - Villa Park CA, US

Assignee:

Broadcom Corporation - Irvine CA

International Classification:

G06F 1/00
G06F 11/30

US Classification:

713300, 713322, 713340

Abstract:

Techniques are disclosed for providing system manageability for computing systems operating under OS-absent conditions. In particular, techniques are disclosed for providing fully functional system management capabilities even when the primary power source for the computing system is disabled. One aspect of the invention relates to a power supply control that facilitates the realization of low power consumption integrated circuit systems. Another aspect of the invention relates to providing fully functional ASF support when operating on auxiliary power. In one embodiment, this is implemented in a local bus adapter/controller that integrates network communication, management, and support features.

US Patent:

7395719, Jul 8, 2008

Filed:

Oct 23, 2006

Appl. No.:

11/552064

Inventors:

Marcos Nassar - Los Angeles CA, US
Scott McDaniel - Simi Valley CA, US

Assignee:

Custom Sensors & Technologies, Inc. - Moorpark CA

International Classification:

G01L 7/00
H01G 7/00

US Classification:

73756, 73756, 3612834

Abstract:

A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.

US Patent:

7899052, Mar 1, 2011

Filed:

Jan 27, 2000

Appl. No.:

09/492265

Inventors:

Yi-Hsien Hao - Saratoga CA, US
Scott McDaniel - Villa Park CA, US
John K. Lenell - Huntington Beach CA, US
Andrew M. Naylor - Costa Mesa CA, US

Assignee:

Broadcom Corporation - Irvine CA

International Classification:

H04L 12/28

US Classification:

370392, 370412

Abstract:

Memory structure, and packet-based switch including the memory structure, having Address Resolution Table and Packet Data Buffer table employing a shared memory. Transmit Descriptor Table also may share memory. Address Resolution Table can be implemented with direct mapping, for which destination address key direct-mapped address search may be used. The memory structure and switch implement an IEEE Std. 802. 3 communication protocol via multiple ports.

US Patent:

8478907, Jul 2, 2013

Filed:

May 3, 2006

Appl. No.:

11/416717

Inventors:

Eliezer Aloni - Zur Yigal, IL
Kobby Carmona - Hod HaSharon, IL
Shay Mizrachi - Hod HaSharon, IL
Rafi Shalom - Givat Shmuel, IL
Merav Sicron - Kfar Sava, IL
Dov Hirshfeld - Givat Shmuel, IL
Amit Oren - Los Altos Hills CA, US
Caitlin Bestler - Laguna Hills CA, US
Uri Tal - Ramat Gan, IL
Uri Elzur - Irvine CA, US
Kan (Frankie) Fan - Diamond Bar CA, US
Scott McDaniel - Villa Park CA, US

Assignee:

Broadcom Corporation - Irvine CA

International Classification:

G03F 15/16
G03F 15/177
G03F 3/00

US Classification:

709250, 709225, 719327, 719321, 719324

Abstract:

A network interface device for use with a host computer that includes a host processor and a memory, and which is configured to concurrently run a master operating system and at least one virtual operating system. The device includes a bus interface that communicates over a bus with the host processor and the memory, and a network interface, which is coupled to send and receive data packets carrying data over a packet network. A protocol processor is coupled between the bus interface and the network interface so as to convey the data between the network interface and the memory while performing protocol processing on the data packets under instructions from the at least one virtual operating system, while bypassing the master operating system.

US Patent:

20020048825, Apr 25, 2002

Filed:

Aug 23, 2001

Appl. No.:

09/934647

Inventors:

Phillip Young - Simi Valley CA, US
Douglas Young - Simi Valley CA, US
Scott McDaniel - Simi Valley CA, US
Gary Bivins - Tujunga CA, US
William Ditto - Chatsworth CA, US
Huong Lam - Simi Valley CA, US

International Classification:

H01L021/00

US Classification:

438/004000

Abstract:

A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.

US Patent:

20070163355, Jul 19, 2007

Filed:

Jan 13, 2006

Appl. No.:

11/332754

Inventors:

Marcos Nassar - Los Angeles CA, US
Scott McDaniel - Simi Valley CA, US

Assignee:

Kavlico Corporation - Moorpark CA

International Classification:

G01L 7/08

US Classification:

073715000, 600488000

Abstract:

A preformed senior housing including a conduit having an inside; a plug disposed within the conduit, and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.