Scott D Olson

US Patent:

6429499, Aug 6, 2002

Filed:

May 18, 2000

Appl. No.:

09/573748

Inventors:

Randolph B. Heineke - Rochester MN
William K. Hogan - Rochester MN
Scott Allen Olson - Rochester MN
Clint Lee Schow - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 31075

US Classification:

257458, 257425, 257438, 257439, 438 57, 438 69, 438 75, 438762

Abstract:

Disclosed is a semiconductor structure and manufacturing process for making an integrated FET and photodetector optical receiver on a semiconductor substrate. A FET is formed by forming at least one p region in a p-well of the substrate and forming at least one n region in the p-well of the substrate. A p-i-n photodetector is formed in the substrate by forming at least one p region in an absorption region of the substrate when forming the at least one p region in the p well of the FET and forming at least one n region in the absorption region of the substrate when forming the at least one n region in the p-well of the FET.

US Patent:

6433638, Aug 13, 2002

Filed:

Sep 6, 2000

Appl. No.:

09/655816

Inventors:

Randolph B. Heineke - Rochester MN
Scott Allen Olson - Rochester MN
David Peter Swart - Pine Island MN
Gerald Wayne Swift - Rolling Hills Estates CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H03F 345

US Classification:

330260, 330 85, 330110, 330311

Abstract:

A fully balanced transimpedance amplifier for high speed and low voltage applications is provided. An input stage of the amplifier uses a matched pair of common source connected transistors with sources tied directly to ground to eliminate the Vds overhead usually found in differential pairs. The ground connection minimizes a source resistance noise component, while matching minimizes power supply noise generation and susceptibility for an array of amplifiers. Feedback resistors along with diode connected MESFETS determine the transimpedance of the amplifier. The nonlinearity of diodes helps to soften clipping. Transresistance also determined the noise generated by the amplifier, and the diode connected MESFETS offer lower noise than resistors for the same impedance. Stability is achieved through use of only a single stage of gain in a loop of the input stage, while additional gain is achieved through cascading in the input stage. A differential stage minimizes any difference in amplitude between two sides of the amplifier input stage.

US Patent:

6489850, Dec 3, 2002

Filed:

Mar 16, 2001

Appl. No.:

09/810133

Inventors:

Randolph B. Heineke - Rochester MN
Scott Allen Olson - Rochester MN
David John Orser - Farmington MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H03F 314

US Classification:

330307, 330295, 330124 R, 330297, 257723, 257728, 257499, 257532

Abstract:

A multichannel parallel IC amplifier includes a plurality of amplifier circuits formed on an IC substrate. Each amplifier circuit is coupled to respective inputs via a pair of capacitors. The capacitors are configured so as to substantially equalize like sense and unlike sense coupling between adjacent channels, leading to cancellation of crosstalk signals.

US Patent:

6574091, Jun 3, 2003

Filed:

Aug 14, 2002

Appl. No.:

10/218789

Inventors:

Randolph B. Heineke - Rochester MN
Scott Allen Olson - Rochester MN
David John Orser - Farmington MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01G 438

US Classification:

361328, 361303, 361311, 361329, 257296, 257309

Abstract:

A multichannel parallel IC amplifier includes a plurality of amplifier circuits formed on an IC substrate. Each amplifier circuit is coupled to respective inputs via a pair of capacitors. The capacitors are configured so as to substantially equalize like sense and unlike sense coupling between adjacent channels, leading to cancellation of crosstalk signals.

US Patent:

6695516, Feb 24, 2004

Filed:

Nov 14, 2001

Appl. No.:

09/992195

Inventors:

Scott DeFields - Oakdale MN
Scott Olson - Mahtomedi MN

Assignee:

Ecolab Inc. - St. Paul MN

International Classification:

A47L 1326

US Classification:

401139, 401137

Abstract:

A system for the formation of a thick robust transparent floor finish layer from a high solids formulation with an applicator device utilizing micro fiber technology. A micro fiber applicator device can be configured to apply a sufficient amount of an aqueous high solids floor finish to obtain a thick robust finish layer in a single application. One system for applying the floor finish can comprise a source of aqueous floor finish and an applicator wand comprising an application nozzle and application surface. Application surface can comprise micro fiber technology in a pad structure comprising a reservoir foam and a micro fiber applicator surface.

US Patent:

6758424, Jul 6, 2004

Filed:

Mar 14, 2003

Appl. No.:

10/380711

Inventors:

Robert J. Lind - Robbinsdale MN
Scott A. Olson - Chippewa Falls WI
Charles E. Kasten - Princeton MN

Assignee:

Graco Minnesota Inc. - Minneapolis MN

International Classification:

B05B 500

US Classification:

239690, 239705, 239706

Abstract:

An electrostatic method for increasing the transfer efficiency of spray finishing using lower voltages than are normally required and used with electrostatic spraying. The positioning and construction of ground electrodes ( ) behind the air cap ( ) helps ensure a clean operation.

US Patent:

6837897, Jan 4, 2005

Filed:

Aug 24, 2001

Appl. No.:

09/939276

Inventors:

Thomas J. Holman - Minneapolis MN, US
Kristi Flury - Maple Grove MN, US
Scott A. Olson - Zimmerman MN, US
Jan Seppala - Maple Grove MN, US
Richard Dunn - Brooklyn Park MN, US
Gina L. Sandvick - Eden Prairie MN, US
Fernando DiCaprio - St. Paul MN, US
Justin E. Plessel - Fridley MN, US

Assignee:

SciMed Life Systems, Inc. - Maple Grove MN

International Classification:

A61M 2900
A61F 206

US Classification:

606194, 623 111

Abstract:

A medical device comprising a support member adjacent to a first member and a second member, the first and second members may be laser welded to one another by directing radiation absorbable by the first and second members at the first and second members. The support member is provided adjacent to the first member and is constructed and arranged to substantially reflect or substantially transmit radiation at one or more frequencies absorbable by at least one of the first member and the second member.

US Patent:

6955490, Oct 18, 2005

Filed:

Jun 19, 2002

Appl. No.:

10/177901

Inventors:

Jane Ann Chase - Plymouth MN, US
Christopher John Lancette - Oakdale MN, US
Scott Randall Olson - Mahtomedi MN, US

Assignee:

Ecolab Inc. - St. Paul MN

International Classification:

A47L013/26
A47L001/08
A46B011/00

US Classification:

401139, 401137, 401 48

Abstract:

A system for the formation of a thick robust transparent floor finish layer from a high solids formulation with an applicator device utilizing micro fiber technology. A micro fiber applicator device can be configured to apply a sufficient amount of an aqueous high solids floor finish to obtain a thick robust finish layer in a single application. One system for applying the floor finish can comprise a source of aqueous floor finish and an applicator wand comprising an application nozzle and application surface. Application surface can comprise micro fiber technology in a pad structure comprising a reservoir foam and a micro fiber applicator surface.