Scott M Shaw

US Patent:

20040065142, Apr 8, 2004

Filed:

Jun 20, 2003

Appl. No.:

10/600720

Inventors:

Scott Shaw - Mesa AZ, US

Assignee:

Automated Control Systems, Inc. - Gilbert AZ

International Classification:

G01M019/00
G01M003/02

US Classification:

073/037000

Abstract:

A flow testing system and method are provided for facilitating the continuous flow testing of fluid flow systems and components. An exemplary flow testing system and method are suitably configured for direct implementation into the manufacturing processes for fluid flow systems and components or for stand-alone operation, and can facilitate increased flow testing throughput. An exemplary flow testing system comprises a flow amplifier subsystem, a piping subsystem, a venturi subsystem, and an output coupling subsystem. The flow amplifier subsystem is configured for coupling to an ambient air source, while the output coupling subsystem is configured for coupling to a fluid flow component for testing. The flow amplifier subsystem and venturi subsystem are configured to provide a forced air flow to facilitate the determination of whether the fluid component has any blockage or other restriction that can prevent the flow of air, and/or whether the fluid component has any leaks, thus allowing air/fluid to flow from within the fluid component to the ambient environment. In addition, the flow testing system can also be configured with a control system configured to provide control of flow testing system and/or various of the subsystems.

US Patent:

20050178188, Aug 18, 2005

Filed:

Apr 4, 2005

Appl. No.:

11/099173

Inventors:

Scott Shaw - Mesa AZ, US

Assignee:

Automated Control Systems, Inc. - Gilbert AZ

International Classification:

G01M003/02

US Classification:

073037000

Abstract:

A flow testing system and method are provided for facilitating the continuous flow testing of fluid flow systems and components. An exemplary flow testing system and method are suitably configured for direct implementation into the manufacturing processes for fluid flow systems and components or for stand-alone operation, and can facilitate increased flow testing throughput. An exemplary flow testing system comprises a flow amplifier subsystem, a piping subsystem, a venturi subsystem, and an output coupling subsystem. The flow amplifier subsystem is configured for coupling to an ambient air source, while the output coupling subsystem is configured for coupling to a fluid flow component for testing. The flow amplifier subsystem and venturi subsystem are configured to provide a forced air flow to facilitate the determination of whether the fluid component has any blockage or other restriction that can prevent the flow of air, and/or whether the fluid component has any leaks, thus allowing air/fluid to flow from within the fluid component to the ambient environment. In addition, the flow testing system can also be configured with a control system configured to provide control of flow testing system and/or various of the subsystems.

US Patent:

53166426, May 31, 1994

Filed:

Apr 22, 1993

Appl. No.:

8/052496

Inventors:

David J. Young - Phoenix AZ
Scott L. Randall - Mesa AZ
Scott D. Shaw - Chandler AZ
Andrew F. Wylde - Tempe AZ

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

C25D 1706
C25D 1716
C25D 2106
C25D 2110

US Classification:

204198

Abstract:

A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically non-conducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate. The shields and the coated magnets function as current shields that control the flow of ions within the plating cell and thereby ensure uniformity of plating thickness at the substrate surface.

US Patent:

53324870, Jul 26, 1994

Filed:

Apr 22, 1993

Appl. No.:

8/052495

Inventors:

David J. Young - Phoenix AZ
Scott L. Randall - Mesa AZ
Scott D. Shaw - Chandler AZ
Andrew F. Wylde - Tempe AZ

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

C25D 502
C25D 2106
C25D 1708
C25D 2110

US Classification:

205 80

Abstract:

A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically nonconducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate. The shields and the coated magnets function as current shields that control the flow of ions within the plating cell and thereby ensure uniformity of plating thickness at the substrate surface.