Shao Wen Li

US Patent:

6489380, Dec 3, 2002

Filed:

Apr 27, 2000

Appl. No.:

09/561852

Inventors:

Xiao-Qi Zhou - San Diego CA
Henry Wevick - Rialto CA
Nancy E. Iwamoto - Ramona CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey Electronics, Inc. - Spokane WA

International Classification:

C08K 308

US Classification:

523427, 523428, 523434, 525113, 525122, 525524

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

6844379, Jan 18, 2005

Filed:

Nov 19, 2002

Appl. No.:

10/300493

Inventors:

Xiao-Qi Zhou - San Diego CA, US
Henry Wevick - Rialto CA, US
Nancy Iwamoto - Ramona CA, US
Shao Wei Li - San Diego CA, US
Alan Grieve - El Cajon CA, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C08K 308
C08L 6300
C08L 7900

US Classification:

523427, 523428, 523434, 525113, 525122, 525524

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

20050148695, Jul 7, 2005

Filed:

Jan 13, 2005

Appl. No.:

11/035391

Inventors:

Xiao-Qi Zhou - San Diego CA, US
Henry Wevick - Rialto CA, US
Nancy Iwamoto - Ramona CA, US
Shao Li - San Diego CA, US
Alan Grieve - El Cajon CA, US

International Classification:

C08L063/00

US Classification:

523427000, 525528000, 156330000

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

6057402, May 2, 2000

Filed:

Aug 12, 1998

Appl. No.:

9/133507

Inventors:

Xiao-Qi Zhou - San Diego CA
Henry Wevick - Rialto CA
Nancy E. Iwamoto - Ramona CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

C08K 308
C08L 6300
C08I 7900

US Classification:

525122

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

US Patent:

53831640, Jan 17, 1995

Filed:

Jun 10, 1993

Appl. No.:

8/074940

Inventors:

Terrence Sejnowski - Solana Beach CA
Shao L. Li - San Diego CA

Assignee:

The Salk Institute for Biological Studies - San Diego CA

International Classification:

G01S 1368

US Classification:

67134

Abstract:

A system for separating mixed signal sources by processing a received signal through the combination of a beamforming network and an adaptive Herault-Jutten network. The conventional Herault-Jutten network is useful for separating independent signals that have been linearly mixed, but cannot separate a mixture of several independent signals in free field conditions because of the propagation time delays between sources and sensors. The system of this invention combines planar beamforming techniques with a conventional HJ network to adaptively distinguish among signals having delays introduced by the propagation medium. A new sensor filter scheme is introduced to eliminate beamforming variation with frequency over the band of interest. The resulting system has application to adaptive interferer rejection and to acoustic and cellular communications receivers.

US Patent:

57445338, Apr 28, 1998

Filed:

Jun 4, 1997

Appl. No.:

8/868508

Inventors:

Nancy E. Iwamoto - Ramona CA
Jesse L. Pedigo - La Mesa CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

C08K 300

US Classification:

524440

Abstract:

Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.

US Patent:

62425137, Jun 5, 2001

Filed:

Oct 12, 1999

Appl. No.:

9/416706

Inventors:

Xiao-Qi Zhou - San Diego CA
Henry Wevick - Rialto CA
Nancy E. Iwamoto - Ramona CA
Shao Wei Li - San Diego CA
Alan Grieve - San Diego CA

Assignee:

Johnson Matthey Electronics, Inc. - Spokane WA

International Classification:

B05D 132
B32B 3126
B32B 3128
C09J16300

US Classification:

523427

Abstract:

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.