Sherry Xiaoqi Zhu

US Patent:

7151010, Dec 19, 2006

Filed:

Feb 4, 2005

Appl. No.:

11/051341

Inventors:

Cam T. Nguyen - San Diego CA, US
Sherry Xiaoqi Zhu - San Diego CA, US

Assignee:

Kyocera Wireless Corp. - San Diego CA

International Classification:

H01L 21/44

US Classification:

438107, 257E25031

Abstract:

Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

US Patent:

7217994, May 15, 2007

Filed:

Dec 1, 2004

Appl. No.:

11/002480

Inventors:

Sherry Xiaoqi Zhu - San Diego CA, US
Cam T. Nguyen - San Diego CA, US

Assignee:

Kyocera Wireless Corp. - San Diego CA

International Classification:

H01L 23/02

US Classification:

257686, 257700, 257723, 257693, 257E25027

Abstract:

A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.