Shou Cheng Chen

age ~98

from Union City, CA

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Shou Jen Chen
President,Secretary,Treasurer

CHENCO MARINE, INC

Wire Bonding Surface And Bonding Method
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US Patent:

62653008, Jul 24, 2001
Filed:

Nov 18, 1993
Appl. No.:

8/154268
Inventors:

Ameet S. Bhansali - Fremont CA
Gay M. Samuelson - Tempe AZ
Venkatesan Murali - San Jose CA
Michael J. Gasparek - Tempe AZ
Shou H. Chen - Mesa AZ
Nicholas P. Mencinger - Tempe AZ
Ching C. Lee - Penang, MY
Kevin Jeng - Cupertino CA
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2144
US Classification:

438612
Abstract:

A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

Bonding Pad Structure Having An Interposed Rigid Layer
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US Patent:

55679811, Oct 22, 1996
Filed:

Mar 31, 1993
Appl. No.:

8/040521
Inventors:

Ameet S. Bhansali - Fremont CA
Gay M. Samuelson - Tempe AZ
Venkatesan Murali - San Jose CA
Michael J. Gasparek - Tempe AZ
Shou H. Chen - Mesa AZ
Nicholas P. Mencinger - Tempe AZ
Ching C. Lee - Penang, MY
Kevin Jeng - Cupertino CA
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2358
H01L 23495
H01L 2348
US Classification:

257643
Abstract:

A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.