Shou I Chen

age ~72

from Davis, CA

Also known as:
  • Shoui Chen

Shou Chen Phones & Addresses

  • Davis, CA
  • Fremont, CA
  • 4 Hyde Park Dr, E Brunswick, NJ 08816 • 7326517630
  • East Brunswick, NJ
  • Hacienda Heights, CA
  • Alhambra, CA
  • Paramus, NJ
  • Hacienda Heights, CA
  • Franklin Park, NJ
  • 4 Hyde Park Dr, E Brunswick, NJ 08816

Resumes

Shou Chen Photo 1

Shou I Chen

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Location:
Davis, CA
Industry:
Research
Work:
Itri
Technical Manager
Name / Title
Company / Classification
Phones & Addresses
Shou Jen Chen
President,Secretary,Treasurer
CHENCO MARINE, INC
Shou Bin Chen
President
VIGOR INTERNATIONAL, INC
1117 9 St, Hacienda Heights, CA 91745

Us Patents

  • Methods For Enhancing Service And Reducing Service Cost In Mobile Satellite Systems

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  • US Patent:
    6430390, Aug 6, 2002
  • Filed:
    Jan 19, 2001
  • Appl. No.:
    09/766433
  • Inventors:
    Faramaz Davarian - Los Angeles CA
    Shou Chen - West Covina CA
  • Assignee:
    Hughes Electronics Corporation - El Segundo CA
  • International Classification:
    H04B 138
  • US Classification:
    455 10, 455 69, 455428, 455429
  • Abstract:
    Methods are provided for determining and enhancing the service efficiency of mobile communications. To assess communication efficiency in each communication region of interest, a signal-fading record is generated for that region and this record is then analyzed to find availability and energy cost for each of a plurality of power-control parameter sets. The results facilitate the selection of power-control parameter sets that enhance system efficiency in each communication region.
  • Wire Bonding Surface And Bonding Method

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  • US Patent:
    62653008, Jul 24, 2001
  • Filed:
    Nov 18, 1993
  • Appl. No.:
    8/154268
  • Inventors:
    Ameet S. Bhansali - Fremont CA
    Gay M. Samuelson - Tempe AZ
    Venkatesan Murali - San Jose CA
    Michael J. Gasparek - Tempe AZ
    Shou H. Chen - Mesa AZ
    Nicholas P. Mencinger - Tempe AZ
    Ching C. Lee - Penang, MY
    Kevin Jeng - Cupertino CA
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    H01L 2144
  • US Classification:
    438612
  • Abstract:
    A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
  • Methods For Enhancing Service And Reducing Service Cost In Mobile Satellite Systems

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  • US Patent:
    62088351, Mar 27, 2001
  • Filed:
    Jul 1, 1998
  • Appl. No.:
    9/109012
  • Inventors:
    Faramaz Davarian - Los Angeles CA
    Shou Chen - West Covina CA
  • Assignee:
    Hughes Electronics Corporation - El Segundo CA
  • International Classification:
    H04B1/38
  • US Classification:
    455 10
  • Abstract:
    Methods are provided for determining and enhancing the service efficiency of mobile communications. To assess communication efficiency in each communication region of interest, a signal-fading record is generated for that region and this record is then analyzed to find availability and energy cost for each of a plurality of power-control parameter sets. The results facilitate the selection of power-control parameter sets that enhance system efficiency in each communication region.
  • Bonding Pad Structure Having An Interposed Rigid Layer

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  • US Patent:
    55679811, Oct 22, 1996
  • Filed:
    Mar 31, 1993
  • Appl. No.:
    8/040521
  • Inventors:
    Ameet S. Bhansali - Fremont CA
    Gay M. Samuelson - Tempe AZ
    Venkatesan Murali - San Jose CA
    Michael J. Gasparek - Tempe AZ
    Shou H. Chen - Mesa AZ
    Nicholas P. Mencinger - Tempe AZ
    Ching C. Lee - Penang, MY
    Kevin Jeng - Cupertino CA
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    H01L 2358
    H01L 23495
    H01L 2348
  • US Classification:
    257643
  • Abstract:
    A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

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Shou Chen Photo 2

Shou Chen Lee

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Shou Chen Photo 3

Kung Shou Chen

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Shou Chen Photo 4

Shou Chen Shen

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Shou Chen Photo 5

Chen Shou

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Friends:
Lee MY
Shou Chen Photo 6

Shou Chen

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Shou Chen Photo 7

Search Names Shou Chen

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Flickr

Googleplus

Shou Chen Photo 16

Shou Chen

Shou Chen Photo 17

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Shou Chen

Myspace

Shou Chen Photo 21

Shou Chen

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Locality:
OGDEN, Utrecht
Birthday:
1924
Shou Chen Photo 22

Shou Chen

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Locality:
LOS ANGELES, California
Birthday:
1941

Youtube

Shou Chen - Alla Crespo: Romantic Evening

  • Duration:
    1m 41s

Master Chen Yu - Tui Shou Applications / -

Welcome to Chen Taiji and Tuishou camp in Moscow, Russia in May 2009! ...

  • Duration:
    2m 13s

Shou Chen - Streabbog: Distant Bells

  • Duration:
    1m 39s

Shou Chen and Aaron Khaled sings Lily's Eyes ...

Sung at the Esplanade Concourse May 2014.

  • Duration:
    3m 21s

Chen ziqiang in Brazil - This is Tuishou

Chen ziqiang in Brazil - This is Tuishou Observed by Master Chen Ziqia...

  • Duration:
    1m 7s

Xueran Chen Great Master OST () Official HD MV

  • Duration:
    3m 35s

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