Faramaz Davarian - Los Angeles CA Shou Chen - West Covina CA
Assignee:
Hughes Electronics Corporation - El Segundo CA
International Classification:
H04B 138
US Classification:
455 10, 455 69, 455428, 455429
Abstract:
Methods are provided for determining and enhancing the service efficiency of mobile communications. To assess communication efficiency in each communication region of interest, a signal-fading record is generated for that region and this record is then analyzed to find availability and energy cost for each of a plurality of power-control parameter sets. The results facilitate the selection of power-control parameter sets that enhance system efficiency in each communication region.
Ameet S. Bhansali - Fremont CA Gay M. Samuelson - Tempe AZ Venkatesan Murali - San Jose CA Michael J. Gasparek - Tempe AZ Shou H. Chen - Mesa AZ Nicholas P. Mencinger - Tempe AZ Ching C. Lee - Penang, MY Kevin Jeng - Cupertino CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2144
US Classification:
438612
Abstract:
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
Methods For Enhancing Service And Reducing Service Cost In Mobile Satellite Systems
Faramaz Davarian - Los Angeles CA Shou Chen - West Covina CA
Assignee:
Hughes Electronics Corporation - El Segundo CA
International Classification:
H04B1/38
US Classification:
455 10
Abstract:
Methods are provided for determining and enhancing the service efficiency of mobile communications. To assess communication efficiency in each communication region of interest, a signal-fading record is generated for that region and this record is then analyzed to find availability and energy cost for each of a plurality of power-control parameter sets. The results facilitate the selection of power-control parameter sets that enhance system efficiency in each communication region.
Bonding Pad Structure Having An Interposed Rigid Layer
Ameet S. Bhansali - Fremont CA Gay M. Samuelson - Tempe AZ Venkatesan Murali - San Jose CA Michael J. Gasparek - Tempe AZ Shou H. Chen - Mesa AZ Nicholas P. Mencinger - Tempe AZ Ching C. Lee - Penang, MY Kevin Jeng - Cupertino CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2358 H01L 23495 H01L 2348
US Classification:
257643
Abstract:
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.