Sidney E Anderson

US Patent:

6462414, Oct 8, 2002

Filed:

Mar 2, 2000

Appl. No.:

09/517799

Inventors:

Sidney Larry Anderson - Fremont CA

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L 2348

US Classification:

257738, 257778, 257779, 257780, 257781, 257786, 22818022, 361768, 361772

Abstract:

An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.

US Patent:

6627517, Sep 30, 2003

Filed:

Nov 17, 2000

Appl. No.:

09/715362

Inventors:

Sidney Larry Anderson - Fremont CA

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L 2130

US Classification:

438455, 438118

Abstract:

A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.

US Patent:

6929978, Aug 16, 2005

Filed:

Aug 13, 2002

Appl. No.:

10/219173

Inventors:

Sidney Larry Anderson - Fremont CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L021/44
H01R043/16

US Classification:

438108, 438612, 438613, 29874

Abstract:

An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.

US Patent:

20020145207, Oct 10, 2002

Filed:

Mar 2, 2000

Appl. No.:

09/517345

Inventors:

Sidney Anderson - Fremont CA, US
Jon Long - Livermore CA, US
Donald Fritz - San Jose CA, US

International Classification:

H01L023/28

US Classification:

257/787000

Abstract:

An integrated circuit package is constructed to potential reduce stress and damage to an integrated circuit die. A rigid transition medium () is attached using adhesive layers () and interfaces between a tape carrier () and the integrated circuit die (). The integrated circuit package prevents damage such as die cracks and also enhances the service life of the packaged integrated circuit part.