Simon J Wood

US Patent:

61308234, Oct 10, 2000

Filed:

Feb 1, 1999

Appl. No.:

9/240623

Inventors:

Alan J. Lauder - Arlington VA
Simon G. Wood - Falls Church VA

Assignee:

Raytheon E-Systems, Inc. - Falls Church VA

International Classification:

H05K 118

US Classification:

361760

Abstract:

A stackable ball grid array module in which a chip select decoder is used to reduce the number of busses required for communication between modules. Additional modules may be added without requiring additional interconnect lines in the array. Cooling of the individual modules may be accomplished using a support member made from an enhanced heat transfer material or placing an enhanced heat transfer material layer between the modules. The devices on the module may be encapsulated, and the modules may be constructed in a chip first or cavity-down configuration. Methods are also disclosed.