Daniel Nelson

US Patent:

6532677, Mar 18, 2003

Filed:

Jun 22, 2000

Appl. No.:

09/599267

Inventors:

Jeffrey M. Dils - Chandler AZ
Daniel B. Nelson - Chandler AZ
John E. Nemazi - Bloomfield Hills MI

Assignee:

One World Technologies Limited

International Classification:

G01B 320

US Classification:

3350105, 3350145, 336791

Abstract:

A molded limit gauge for measuring workpiece thicknesses. The limit gauge includes a body having one or more elongate ridges extending longitudinally therealong. Each ridge has a plurality of notches extending laterally through its upper portion. Each notch has a unique longitudinal dimension that is uniform. In a first preferred embodiment of the invention, the bottom surface of each notch and the land between each notch is horizontally flat. In a second preferred embodiment, each of these surfaces has a configuration of a laterally convex curve. The limit gauge body is configured such that it can be mounted atop a planing machine. So mounted, it can function as a structural top of the planing machine. Measurement of a board thickness is accomplished by attempting to slide the board through notches that appear to match its thickness. A range of board thickness is defined between the indicated sizes of two adjacent notches that respectively allow and do not allow passage of the board through.

US Patent:

6942360, Sep 13, 2005

Filed:

Aug 23, 2004

Appl. No.:

10/924389

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Nelson - Cave Creek AZ, US
Thomas Kulaga - Chandler AZ, US

Assignee:

Enertron, Inc. - Mesa AZ

International Classification:

F21V021/00
H01L033/00

US Classification:

362238, 362 27, 362249, 362800, 257 79, 257 88, 257 99

Abstract:

An LED light engine having a high thermal conductivity substrate (e. g. , a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e. g. , optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e. g. , a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e. g. , a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.

US Patent:

6982518, Jan 3, 2006

Filed:

Sep 16, 2004

Appl. No.:

10/943061

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Nelson - Cave Creek AZ, US
Thomas Kulaga - Chandler AZ, US

Assignee:

Enertron, Inc. - Mesa AZ

International Classification:

H01L 33/00
F21V 29/00

US Classification:

313 46, 313498, 362800

Abstract:

An LED lighting device for use in place of a commercial-standard light bulb. For example, a commercial-standard light bulb typically has an outer surface profile, generally defining its shape and the LED lighting device has its own surface profile which substantially mimics the surface profile of the commercial-standard light bulb. Additionally, LED lighting device may further comprise a heat sink for dissipating energy generated by the LED lighting device. In accordance with various embodiments, the heat sink creates the LED lighting device's outer surface profile and is configured to substantially mimic the outer surface profile of the commercial-standard light bulb.

US Patent:

6997241, Feb 14, 2006

Filed:

Jan 23, 2002

Appl. No.:

10/055434

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Todd Nelson - Cave Creek AZ, US

Assignee:

Enertron, Inc. - Mesa AZ

International Classification:

F28F 7/00

US Classification:

165 803, 165 10, 16510433

Abstract:

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions.

US Patent:

D528227, Sep 12, 2006

Filed:

Mar 24, 2004

Appl. No.:

29/201970

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Nelson - Cave Creek AZ, US
Thomas Kulaga - Chandler AZ, US

Assignee:

Enertron, Inc. - Chandler AZ

International Classification:

2604

US Classification:

D26 2

US Patent:

7191820, Mar 20, 2007

Filed:

Feb 14, 2006

Appl. No.:

11/354473

Inventors:

Der Jeou Chou - Mesa, Maricopa County AZ, US
Daniel Todd Nelson - Cave Creek AZ, US

Assignee:

Enertron, Inc. - Chandler AZ

International Classification:

F28D 15/00
F28D 19/00

US Classification:

165 10, 165 803, 16510433

Abstract:

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions.

US Patent:

7424907, Sep 16, 2008

Filed:

Jul 1, 2003

Appl. No.:

10/611484

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Todd Nelson - Cave Creek AZ, US

Assignee:

Enertron, Inc. - Tempe AZ

International Classification:

H05K 7/20

US Classification:

165 804, 16510433, 165121, 361699

Abstract:

An integrated fan pump includes a fan, a pump, and an electrical drive mechanism such as an electric motor configured to simultaneously drive both the fan and pump with respect to the housing. A heat exchanger is preferably connected to the pump and the component to be cooled. In one embodiment, the fan head and the pump head are fixed to a common axle, a single magnet is fixed to the fan head, and the magnetic coil is fixed to the housing. In another embodiment, the fan head and pump head rotate about a fixed axle, the magnetic coil is fixed to said housing, one magnet is fixed to the fan head, and a second magnet is fixed to the pump head.

US Patent:

7431477, Oct 7, 2008

Filed:

Apr 22, 2005

Appl. No.:

11/112918

Inventors:

Der Jeou Chou - Mesa AZ, US
Daniel Nelson - Cave Creek AZ, US
Thomas Kulaga - Chandler AZ, US

Assignee:

Enertron, Inc. - Tempe AZ

International Classification:

F21V 33/00

US Classification:

362240, 362247, 362249, 362310, 362800

Abstract:

An LED light engine comprising a high thermal conductivity substrate (e. g. , a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e. g. , optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e. g. , a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e. g. , a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.