Somdeth X Xaysongkham

US Patent:

63034093, Oct 16, 2001

Filed:

Dec 8, 1999

Appl. No.:

9/456466

Inventors:

Maurice Karpman - Brookline MA
David Courage - Methuen MA
Somdeth Xaysongkham - Lowell MA

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 2144

US Classification:

438114

Abstract:

Methods are provided for separating microcircuit dies from a wafer, which includes microcircuit dies containing componentry on a circuit side thereof and streets separating the dies from each other. A first wafer mount film is affixed to the circuit side of the wafer, and the dies are detached along the streets with the circuit side of the wafer fixed to the first wafer mount film, thereby forming a divided wafer. A second wafer mount film is fixed to the back side of the divided wafer, and the first wafer mount film is removed from the divided wafer so that the dies remain fixed to the second wafer mount film with their circuit sides exposed. The second wafer mount film preferably has greater adhesion to the divided wafer than the first wafer mount film when the first wafer mount film is removed from the divided wafer. The first wafer mount film may comprise a protective film having holes aligned with fragile components on the dies and a cover film that covers the holes. The protective film may be an ultraviolet-curable film that exhibits reduced adhesion to the divided wafer after exposure to ultraviolet radiation.