Son Hoang Trinh

US Patent:

7067045, Jun 27, 2006

Filed:

Oct 18, 2002

Appl. No.:

10/274722

Inventors:

Arthur Keigler - Wellesley MA, US
Harald Herchen - Los Altos CA, US
Vincent E. Burkhart - San Jose CA, US
Son N. Trinh - Cupertino CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25B 9/02

US Classification:

20429706, 20429701, 20429707, 20429708, 20429709, 2042971, 2042861, 204287

Abstract:

An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.