Stephen Anthony Greer

US Patent:

6538883, Mar 25, 2003

Filed:

Sep 19, 2001

Appl. No.:

09/957153

Inventors:

Stephen Greer - Santa Rosa CA

Assignee:

Turin Networks - Petaluma CA

International Classification:

H05K 720

US Classification:

361687, 361704, 165 16, 174 152

Abstract:

An electronic system is described having electronic components and an air flow channel that directs cooled air across the electronic components and directs warmed air into a heat exchanger. The electronic components and air flow channel are within a thermal insulating barrier. The heat exchanger converts the warmed air into the cooled air. The heat exchanger has an interface that couples to a ground loop that accepts warmed fluid from the heat exchanger and provides cooled fluid to the heat exchanger when the ground loop is at least partially located within the earth.

US Patent:

6775431, Aug 10, 2004

Filed:

Apr 18, 2001

Appl. No.:

09/838085

Inventors:

Lawrence E. Foltzer - Occidental CA
Stephen S. Greer - Santa Rosa CA
Josef T. Hoog - Novato CA
Van Odell - Novato CA

Assignee:

Turin Networks - Petaluma CA

International Classification:

G02B 626

US Classification:

385 20, 385 16

Abstract:

An apparatus comprising a first plate having a plurality of v-shaped grooves to hold a set of optical fibers and a second plate having a v-shaped groove to hold a secondary optical fiber is disclosed. In one embodiment, the second plate being movable relative to the first plate, so that the secondary optical fiber can be selectively coupled to one of the optical fibers of the first set of optical fibers.

US Patent:

6804114, Oct 12, 2004

Filed:

Feb 5, 2003

Appl. No.:

10/361131

Inventors:

Stephen Greer - Santa Rosa CA

Assignee:

Turin Networks - Petaluma CA

International Classification:

H05K 720

US Classification:

361687, 361704, 165 16, 174 152

Abstract:

An electronic system is described having electronic components and an air flow channel that directs cooled air across the electronic components and directs warmed air into a heat exchanger. The electronic components and air flow channel are within a thermal insulating barrier. The heat exchanger converts the warmed air into the cooled air. The heat exchanger has an interface that couples to a ground loop that accepts warmed fluid from the heat exchanger and provides cooled fluid to the heat exchanger when the ground loop is at least partially located within the earth.

US Patent:

8064200, Nov 22, 2011

Filed:

Sep 14, 2008

Appl. No.:

12/210211

Inventors:

Stephen J. West - Petaluma CA, US
Scott Pradels - Santa Rosa CA, US
Stephen S. Greer - Santa Rosa CA, US

Assignee:

Cyan Optics, Inc. - Petaluma CA

International Classification:

H05K 7/20

US Classification:

361695, 361694, 454184

Abstract:

Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

US Patent:

61559210, Dec 5, 2000

Filed:

Nov 4, 1999

Appl. No.:

9/433334

Inventors:

Susan Evans - Rohnert Park CA
Stephen Greer - Santa Rosa CA
Rodney Marcantel - Coppell TX
Alan Wardlow - Petaluma CA

Assignee:

Alcatel USA Sourcing L.P. - Plano TX

International Classification:

H05K 720

US Classification:

454184

Abstract:

An apparatus for extinguishing fires in enclosures having an air ramp with an automatic trap door. When the trap door is tripped, the air flow is reduced. Fires can be extinguished through the reduced air flow. The air ramp includes a center section having an upwardly ramped center area, a trap door which is moveably attached to the center area and a front section which is connected to the center section. The front section allows the air ramp to be mounted in an enclosure.

US Patent:

58846930, Mar 23, 1999

Filed:

Dec 31, 1997

Appl. No.:

/001624

Inventors:

Thomas A. Austin - Santa Rosa CA
Stephen Greer - Santa Rosa CA
Andrew Low - McKinney TX

Assignee:

DSC Telecom L.P. - Plano TX

International Classification:

F28D 1500

US Classification:

16510433

Abstract:

A passive cooling system for cooling an enclosure containing electronic components. A hollowed portion of the enclosure is formed as an integral heat pipe containing a working fluid. The hollowed portion has an evaporator section located at the top and a condenser section located at the bottom. The enclosure also has hollowed side walls which serve as passage ways for the working fluid to flow through in between the evaporator and condenser sections. Gravity and the pressure of evaporation force the working fluid down to the condenser section. A wick is provided for returning the working fluid to the evaporator section by capillary action. Additionally, an ultrasonic transducer driven by the heat rejected from the condenser section may be used to help return the working fluid to the evaporator section. Finally, a check valve may be employed before the evaporator section for the working fluid to flow through.

US Patent:

60655305, May 23, 2000

Filed:

Dec 31, 1997

Appl. No.:

9/001617

Inventors:

Thomas A. Austin - Santa Rosa CA
Matthew K. Meeker - Santa Rosa CA
Stephen S. Greer - Santa Rosa CA
Dwayne C. Green - Santa Rosa CA

Assignee:

Alcatel USA Sourcing, L.P. - Plano TX

International Classification:

H05K 720

US Classification:

165 803

Abstract:

An enclosure which acts as a heat sink for dissipating heat generated by electronic components within the housing. The outer surface of the enclosure includes numerous cooling fins, preferably on all six faces of the enclosure, to help dissipate heat. The fins are diagonally oriented, rather than vertical or horizontal, to permit them to be effective whether the unit is mounted horizontally or vertically. In addition to dissipating heat, the enclosure is rain tight, EMI-tight and ESD-tight. The inside major surfaces of the enclosure include a number of pins extending inwardly to help increase the surface area for heat transfer into the enclosure material. The pins extend deeply into the interior of the enclosure, and are made shorter only where necessary to avoid large components on the printed circuit card. The spaces between the pins allow convection of the heated air whether the enclosure is vertically or horizontally mounted. The fins and pins together maximize heat dissipation from the electronics within the enclosure regardless of whether the enclosure is vertically or horizontally mounted.

US Patent:

6076595, Jun 20, 2000

Filed:

Oct 21, 1998

Appl. No.:

9/176564

Inventors:

Thomas A. Austin - Santa Rosa CA
Stephen Greer - Santa Rosa CA
Andrew Low - McKinney TX

Assignee:

Alcatel USA Sourcing, L.P. - Plano TX

International Classification:

F28D 1500

US Classification:

16510426

Abstract:

A passive cooling system for cooling an enclosure containing electronic components. A hollowed portion of the enclosure is formed as an integral heat pipe containing a working fluid. The hollowed portion has an evaporator section located at the top and a condenser section located at the bottom. The enclosure also has hollowed side walls which serve as passage ways for the working fluid to flow through in between the evaporator and condenser sections. Gravity and the pressure of evaporation force the working fluid down to the condenser section. A wick is provided for returning the working fluid to the evaporator section by capillary action. Additionally, an ultrasonic transducer driven by the heat rejected from the condenser section may be used to help return the working fluid to the evaporator section. Finally, a check valve may be employed before the evaporator section for the working fluid to flow through.