Stephen G Hooper

US Patent:

D606795, Dec 29, 2009

Filed:

Sep 14, 2009

Appl. No.:

29/343462

Inventors:

Yi-Chun Liao - San Jose CA, US
Benjamin Pei-Ming Chia - Cupertino CA, US
Stephen Hooper - Los Gatos CA, US

Assignee:

Espressi, Inc. - San Jose CA

International Classification:

0701

US Classification:

D 7300, D7399, D7309

US Patent:

D614432, Apr 27, 2010

Filed:

Mar 19, 2009

Appl. No.:

29/334074

Inventors:

Yi-Chun Liao - San Jose CA, US
Benjamin Pei-Ming Chia - San Jose CA, US
Stephen Hooper - Los Gatos CA, US

Assignee:

Espressi, Inc. - San Jose CA

International Classification:

0701

US Classification:

D 7300, D7399, D7309

US Patent:

8381635, Feb 26, 2013

Filed:

Dec 29, 2009

Appl. No.:

12/649269

Inventors:

Stephen J. O'Brien - San Jose CA, US
Jacques Gagne - Los Gatos CA, US
Stephen Hooper - Los Gatos CA, US
Benjamin Pei-Ming Chia - Cupertino CA, US
Yi-Chun Liao - Taichung, TW
Ray Gradwohl - Saratoga CA, US
Kenneth Robertson - San Jose CA, US

Assignee:

Espressi, Inc. - San Jose CA

International Classification:

A47J 31/44
A47J 31/00

US Classification:

99302R, 99295, 993231, 99323

Abstract:

A brewing device comprising a brewing system; a handle assembly coupled to the brewing system and containing a source of compressed fluid; and a valve system, coupled to the handle, to selectively place the source of compressed fluid in fluid communication with the brewing system.

US Patent:

20100162899, Jul 1, 2010

Filed:

Apr 16, 2009

Appl. No.:

12/425365

Inventors:

Stephen J. O'Brien - San Jose CA, US
Yi-Chun Liao - San Jose CA, US
Stephen Hooper - Los Gatos CA, US
Benjamin Pei-Ming Chia - Cupertino CA, US
Jacques Gagne - Los Gatos CA, US
Ray Gradwohl - San Jose CA, US
Kenneth Robertson - San Jose CA, US

International Classification:

A47J 31/32

US Classification:

99302 R

Abstract:

A brewing device comprising a brewing system; a handle assembly coupled to the brewing system and containing a source of compressed fluid; and a valve system, coupled to the handle, to selectively place the source of compressed fluid in fluid communication with the brewing system.

US Patent:

20200334213, Oct 22, 2020

Filed:

Jul 2, 2020

Appl. No.:

16/919459

Inventors:

- Redwood Shores CA, US
Stephen Hooper - Escondido CA, US

Assignee:

Oracle International Corporation - Redwood Shores CA

International Classification:

G06F 16/182
G06F 16/13
G06F 16/14
G06F 16/17

Abstract:

Techniques for processing composite commands in a file system are disclosed. A file system receives a composite command that includes an argument. The file system parses the argument and encounters a particular flag indicating that the argument includes an additional command. The file system executes the additional command using an application programming interface (API).

US Patent:

20180285384, Oct 4, 2018

Filed:

Mar 28, 2017

Appl. No.:

15/471267

Inventors:

- Redwood Shores CA, US
Stephen Hooper - Escondido CA, US

Assignee:

Oracle International Corporation - Redwood Shores CA

International Classification:

G06F 17/30

Abstract:

Techniques for processing composite commands in a file system are disclosed. A file system receives a composite command that includes an argument. The file system parses the argument and encounters a particular flag indicating that the argument includes an additional command. The file system executes the additional command using an application programming interface (API).

US Patent:

20180188203, Jul 5, 2018

Filed:

Feb 27, 2018

Appl. No.:

15/907126

Inventors:

- Austin TX, US
Jose FERNANDEZ VILLASENOR - San Jose CA, US
Stephen R. HOOPER - Mesa AZ, US
Patrice M. PARRIS - Phoenix, AZ

International Classification:

G01N 27/414

Abstract:

Embodiments of sensing devices include one or more integrated circuit (IC) die, a housing, and a fluid barrier material. Each IC die includes an electrode-bearing surface and a contact surface. One of the die includes an SFET with a sensing electrode proximate to the electrode-bearing surface. The same or a different die includes a reference electrode proximate to the electrode-bearing surface. The die(s) also include IC contacts at the contact surface(s), and conductive structures coupled between the SFET, the reference electrode, and the IC contacts. The housing includes a mounting surface, and housing contacts formed at the mounting surface. The IC contacts are coupled to the housing contacts. The fluid barrier material is positioned between the mounting surface and the IC die. The fluid barrier material provides a fluid barrier between the IC and housing contacts and a space that encompasses the sensing electrode and the reference electrode.

US Patent:

20170038209, Feb 9, 2017

Filed:

Aug 15, 2014

Appl. No.:

14/460795

Inventors:

PHILIP H. BOWLES - SAN DIEGO CA, US
STEPHEN R. HOOPER - MESA AZ, US

International Classification:

G01C 19/5733
G01P 15/18
G01P 15/08
G01P 15/14
B81B 7/00
B81C 3/00

Abstract:

Methods for fabricating microelectronic packages and microelectronic packages having split gyroscope structures are provided. In one embodiment, the microelectronic package includes a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon. The microelectronic package further includes a second MEMS die, which has a second MEMS gyroscope structure thereon and which is positioned in a stacked relationship with the first MEMS die. The first and second MEMS gyroscope structures overlap as taken along a first axis orthogonal to a principal axis of the first MEMS die.