Stephen Lee James

US Patent:

20130168838, Jul 4, 2013

Filed:

Feb 22, 2013

Appl. No.:

13/773905

Inventors:

Micron Technology, Inc. - Boise ID, US
Stephen L. James - Flagstaff AZ, US

Assignee:

MICRON TECHNOLOGY, INC. - Boise ID

International Classification:

H01L 23/495

US Classification:

257667, 257676

Abstract:

Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as a paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice.